STYCAST 2760
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Vinyl-Wire Potting Adhesion
- 60-Minute Low-Viscosity Processing
- Room-Temperature or Heat Cure
Product Description
LOCTITE STYCAST 2760 Epoxy Encapsulant is a two-component black epoxy/urethane system for potting components containing vinyl-insulated wires or cables. Parts A and B mix 100:50 by weight to produce a typical viscosity of 18,000 mPa s and a 60-minute work life at 25 deg C. The material cures at room temperature or with heat and can be post-cured for final performance. Its cured properties include Shore D 80 hardness, electrical insulation, mechanical strength, and a -40 to 130 deg C operating range, while the formulation provides adhesion to vinyl substrates.
Key features
- Vinyl-substrate adhesion: The system is formulated for vinyl-insulated wires, cables, and related substrates.
- Controlled processing window: The 100 g mixture has a typical 60-minute work life at 25 deg C.
- Ambient or heat cure: The product supports room-temperature cure or accelerated schedules at 65 or 100 deg C.
Applications
Applications include potting electrical and electronic components containing vinyl-insulated wires or cables and encapsulation requiring adhesion to vinyl.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied and mixed properties for the fixed Part A and Part B system.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component A viscosity | 53,000 | mPa s (cP) | Brookfield; typical |
| Component B viscosity | 9,600 | mPa s (cP) | Brookfield; typical |
| Mix ratio by weight | 100:50 | Component A:Component B | |
| Mix ratio by volume | 100:55 | Component A:Component B | |
| Mixed viscosity | 18,000 | mPa s (cP) | Brookfield; typical |
| Mixed density | 1.55 | g/cm^3 | Typical |
| Work life | 60 | minutes | 100 g at 25 deg C |
| Cure schedule | 24 to 48 h at 25 deg C; 4 h at 65 deg C; 2 h at 100 deg C | Guideline alternatives |
After-processing / final-state properties
Typical cured-system properties after the room-temperature or heat-cure schedule.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating temperature range | -40 to 130 | deg C | Cured system |
| Hardness | 80 | Shore D | Typical cured value |
| Coefficient of thermal expansion | 122 | 10^-6/deg C | TMA |
| Thermal conductivity | 0.6 | W/(m K) | Typical cured value |
| Dielectric strength | 17.7 | kV/mm | Typical cured value |
| Volume resistivity | >1 x 10^14 | ohm cm | 25 deg C |
| Flexural strength | 15.9 | N/mm^2 | Typical cured value |
| Compressive strength | 76 | N/mm^2 | Typical cured value |
