STYCAST 1265

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

STYCAST 1265

Main features

  • Soft-Gel Stress-Sensitive Encapsulation
  • Extended 24-Hour Work Life
  • Cuttable Repair Access

Product Description

LOCTITE STYCAST 1265 Epoxy Encapsulant is a clear, two-component epoxy system that cures to a soft gel for encapsulating stress-sensitive electrical and electronic components. The 100:100 by-weight mix has a typical mixed viscosity of 600 cP, a specific gravity of 1.08, and more than 24 hours of working life at 25 deg C. Its low-exotherm cure can proceed at room temperature or with heat, while the final 25 Shore A material remains cuttable for repair access and repouring. The nonconductive gel supports inspection, protection, and re-entry in delicate assemblies.

Key features

  • Soft-gel encapsulation: The cured material has a typical hardness of 25 Shore A.
  • Extended working time: More than 24 hours of work life supports controlled filling and assembly.
  • Repair-accessible protection: The cured gel can be cut and repoured for inspection or repair.

Applications

Applications include encapsulation of stress-sensitive electrical and electronic components requiring a soft, nonconductive gel and later repair access.

Technical Specifications

General Properties
Component System Component System
Two Part (Resin | Hardener)
Electrical Properties
Volume Resistivity Volume Resistivity
10¹² Ohms⋅cm
Other Properties
Storage Temperature Storage Temperature
25 °C
Thermal Properties
Operating Temperature Operating Temperature
-40 to 90 °C

Additional Information

Technical properties

As-supplied / before-processing properties

Property Value Unit Method / condition
Product form Two-component clear epoxy system Part A and Part B
Mix ratio 100:100 parts by weight Part A:Part B
Part A viscosity 10,000 cP 25 deg C; typical
Part B viscosity 230 cP 25 deg C; typical
Mixed viscosity 600 cP 25 deg C; typical
Mixed specific gravity 1.08 25 deg C; typical
Working life >24 hours 100 g mass at 25 deg C
Cure schedule 3-7 d at 25 deg C; 48 h at 45 deg C; 16 h at 65 deg C; 4 h at 95 deg C Typical options
Technical properties

After-processing / final-state properties

Property Value Unit Method / condition
Operating temperature -40 to 90 deg C Cured material
Hardness 25 Shore A Typical cured value
Volume resistivity 1 x 10^12 ohm cm 25 deg C
Dielectric constant 3.0 1 MHz
Dissipation factor 0.02 1 MHz

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