PERMABOND ES569
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Single-Part Heat-Cure Structural Epoxy
- Up to 5 mm Gap Filling
- Solder-Reflow-Resistant Electronics Bonding
Product Description
Permabond® ES569 is a single-part, heat-cured epoxy paste designed to deliver exceptionally high bond strength to both metal surfaces and composite materials. Formulated as a non-sagging, thixotropic paste with high wet strength, it is capable of filling large gaps and resisting flow on vertical surfaces. Its robust structural performance makes it a viable alternative to traditional mechanical fastening, soldering, brazing, or welding techniques.
Key features
- Electronics optimized: Exhibits high wet strength, is non-stringing, produces an excellent drop profile, and withstands solder reflow processes, making it ideal for electronic component bonding.
- Non-sag formulation: The thixotropic paste consistency ensures the adhesive will not flow during application or the heat-curing cycle, allowing for gap filling up to 5 mm.
- Single-part convenience: Requires no mixing and cures efficiently with heat via oven or induction methods, streamlining manufacturing processes.
Applications / Suitable for
- Bonding metals (steel, aluminum, zinc) and composites (FRP glass/epoxy, carbon fiber)
- Bonding electronic components that undergo solder reflow processes
- Applications requiring a structural replacement for mechanical fastening or welding
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Thermal Properties
Other Properties
Additional Information
As-supplied / before-processing properties
Typical properties; these values are not intended for use in preparing specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Chemical Composition | Epoxy Resin | - | - |
| Appearance | Black Paste | - | - |
| Viscosity | 250,000 to 500,000 | cP | at 25°C (mPa.s) |
| Specific Gravity | 1.2 | - | - |
| Maximum Gap Fill | 5 | mm | (0.2 in) |
| Flash Point | > 100 | °C | - |
| Volatile Organic Compound | < 2 | % | 20 g/L (Estimated) |
After-processing / final-state properties
Typical properties; these values are not intended for use in preparing specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Flow at High Temperature | No flow | - | High wet strength |
| Cure Speed | < 3 | minutes | Induction |
| Cure Speed | 75 | minutes | Oven at 130°C (266°F) |
| Cure Speed | 60 | minutes | Oven at 150°C (300°F) |
| Cure Speed | 40 | minutes | Oven at 170°C (338°F) |
| Shear Strength | 27-41 | N/mm² | Steel (ISO 4587) (4000-6000 psi) |
| Shear Strength | 17-31 | N/mm² | Aluminium (2500-4500 psi) |
| Shear Strength | 14-27 | N/mm² | Zinc (2000-4000 psi) |
| Shear Strength | 11 | N/mm² | FRP Glass/Epoxy (1300-1600 psi) |
| Shear Strength | 10-12 | N/mm² | Carbon Fibre (1450-1700 psi) |
| Peel Strength | 100-120 | N/25 mm | Aluminium (ISO 4578) |
| Hardness | 80-85 | Shore D | ISO 868 |
| Coefficient of Thermal Expansion | 90E-6 | mm/mm/°C | (under Tg) |
| Coefficient of Thermal Expansion | 180E-6 | mm/mm/°C | (above Tg) |
| Thermal Conductivity | 0.5 | W/(m.K) | - |
| Glass Transition Temperature (Tg) | 130 | °C | (266°F) DSC |
