LOCTITE SI 5421

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE ABLESTIK SI 5421

Main features

  • Room temperature cure
  • Low stress
  • EMI Shielding gasketing material

Product Description

LOCTITE SI 5421, Silicone, Bonding or Gasketing, Flexible, Formed-in-place, Electrically Conductive Adhesive. It enhances the load bearing & shock absorbing characteristics of the bond area.

LOCTITE SI 5421 is used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures. It is a room temperature vulcanizing adhesive that moisture cures in 24h to make a flexible, formed-in-place, electrically conductive bond.

Surface Cure

  • LOCTITE SI 5421 becomes tack free on exposure to atmospheric moisture within 1 hour at 23±2°C / 50±5%RH.

Technical Specifications

General Properties
Specific Gravity Specific Gravity
3.05
Thermal Properties
Thermal Conductivity Thermal Conductivity
0.81 W/m.K
Electrical Properties
Volume Resistivity Volume Resistivity
0.01 Ohms⋅cm
Mechanical Properties
Elongation Elongation
40 %

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