LOCTITE D125 F

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LOCTITE D125 F

Main features

  • Low exotherm
  • High speed dispensing
  • Low cure temperature

Product Description

LOCTITE D 125 F is a one-component, heat-curable epoxy adhesive specifically formulated for high-speed dispensing in surface mount technology (SMT) assembly. With its low exotherm and minimal water absorption, LOCTITE D 125 F reduces thermal stress on components while ensuring strong adhesion and process reliability.

This yellow adhesive exhibits excellent non-sag and non-stringing characteristics, enabling precise, clean application for chip capacitors, chip resistors, SOTs, SOICs, and PLCCs. It offers high hot strength and fast curing at low temperatures, making it well-suited for demanding, high-throughput electronic manufacturing.

Applications

  • Surface mount assembly of chip capacitors and resistors
  • Bonding SOTs, SOICs, PLCCs, and other SMT components
  • High-speed, precision dispensing processes
  • Electronics production requiring low cure temperatures and non-sag adhesives
Product Family

LOCTITE D125

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Technical Specifications

General Properties
Specific Gravity Specific Gravity
1.275
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
85 °C
Thermal Conductivity Thermal Conductivity
0.3 W/m.K
Electrical Properties
Volume Resistivity Volume Resistivity
1e 14 Ohms⋅cm
Physical Properties
Viscosity Viscosity
1750000 mPa.s

Additional Information

Cure Profiles
IR or Convection Conveyor Oven:

  • 20 min @ 100 °C

  • 7 min @ 110 °C

  • 2.5 min @ 120 °C

  • 1.5 min @ 150 °C

Convection Box Oven:

  • 30 min @ 100 °C

  • 20 min @ 110 °C

  • 10 min @ 120 °C

  • 5 min @ 150 °C

*Note: Ramp-up should not exceed 1 °C per second

Thawing

  1. Remove the adhesive from cold storage.

  2. Allow the material to reach room temperature (25 °C) before use.

  3. Do not re-freeze once thawed.

  4. Once thawed, apply using the recommended methods.

Directions for Use

  1.  LOCTITE D125 F can be applied by dispensing, pin transfer, screen or stencil printing.
  2. Equipment set-up and related product information is available from your Henkel Corporation support group.

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