LOCTITE 383
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- High-Viscosity Placement Control
- 0.602 W/(m K) Thermal Bonding
- One-Component Thermal Bonding System
Product Description
LOCTITE® 383 is a one-component, thermally conductive modified acrylic adhesive designed for bonding heat-generating electronic components to heat sinks and printed circuit board assemblies. The grey, high-viscosity paste provides excellent heat dissipation through its enhanced thermal conductivity while delivering high structural strength after cure. Used with a compatible activator, LOCTITE 383 cures at room temperature, enabling efficient assembly and service-friendly reworkability. Typical applications include bonding transformers, transistors and other heat-generating components where both thermal management and mechanical reliability are required.
Key Features & Benefits
- One-component modified acrylic adhesive.
- Thermally conductive formulation for efficient heat dissipation.
- Room-temperature cure with activator.
- High structural strength for electronic assemblies.
- Excellent bonding of heat-generating components to heat sinks.
- Controlled strength allows field and service repair.
- Suitable for thermally sensitive electronic applications.
Recommended Applications
- Bonding transformers to heat sinks.
- Attaching transistors and power devices.
- Electronic assembly thermal management applications.
- Printed circuit board assemblies requiring heat dissipation.
- Structural bonding of electronic components.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Mechanical Properties
Electrical Properties
Additional Information
As-Supplied / Before-Processing Properties
| Property | Value | Unit | Condition |
|---|---|---|---|
| Technology | Modified Acrylic | — | Thermally conductive adhesive |
| Appearance | Grey Paste | — | Uncured |
| Components | One Component | — | No mixing required |
| Specific Gravity | 1.5 | — | 25°C |
| Viscosity | 500,000 - 1,100,000 | mPa·s | Brookfield HBT, 25°C |
| Cure Method | Activator Cure | — | Room-temperature cure |
| Strength Classification | High | — | Structural bonding |
After-Processing / Final-State Properties
| Property | Value | Unit | Condition / Method |
|---|---|---|---|
| Thermal Conductivity | 0.602 | W/m·K | ISO 8302 |
| Coefficient of Thermal Expansion | 71 × 10⁻⁶ | K⁻¹ | ISO 11359-2 |
| Tensile Strength at Break | 16 | N/mm² | ISO 527-3 |
| Elongation at Break | 7.8 | % | ISO 527-3 |
| Young's Modulus | 1,600 | N/mm² | ISO 527-3 |
| Volume Resistivity | 5.2 × 10¹¹ | Ω·cm | IEC 60093 |
| Surface Resistivity | 8.6 × 10¹³ | Ω | IEC 60093 |
| Dielectric Breakdown Strength | 1.5 | kV/mm | IEC 60243-1 |
| Lap Shear Strength (Steel, 0.05 mm Gap) | ≥12.4 | N/mm² | ISO 4587 |
