Loctite Ablestik 2116 Non-Conductive Adhesive
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Metal/Glass/Ceramic/Plastic Staking and Bonding
- 30-Minute Pot Life
- 415 V/mil Dielectric Strength
Product Description
LOCTITE ABLESTIK 2116 is a two-part, solvent-free, non-conductive epoxy adhesive for staking and bonding applications where added mechanical and structural rigidity is required. The mixed adhesive has a typical viscosity of 100,000 mPa·s at 25°C, a 30-minute pot life, and a 100:22 resin-to-hardener mix ratio by weight. Guideline cure schedules are 24 hours at 25°C or 4 hours at 65°C. The product is documented for bonding metals, glass, ceramics, and most plastics and has an operating temperature range of −60 to 130°C. Typical cured properties include Shore D 90 hardness, a 115°C glass transition temperature, and 415 V/mil dielectric strength.
Key features
- Non-conductive, solvent-free epoxy: Two-part resin and hardener system for staking and bonding applications.
- Flexible cure options: Guideline cure schedules are 24 hours at 25°C or 4 hours at 65°C, with a typical 30-minute pot life.
- Electrical insulation properties: Typical cured dielectric strength is 415 V/mil, with volume resistivity of 6 × 1013 Ω·cm at 25°C.
Applications / Suitable for
- Staking compound applications
- Bonding assemblies where added mechanical and structural rigidity is required
- Bonding metals, glass, ceramics, and most plastics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical product and mixed-material properties for product evaluation. These values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Components | Two part — Resin & Hardener | — | As supplied |
| Color | Milky, translucent | — | As supplied |
| Mix ratio, Resin : Hardener | 100 : 22 | by weight | Resin : Hardener |
| Mixed viscosity | 100,000 | mPa·s (cP) | At 25°C; mixed material |
| Specific gravity | 1.26 | — | Mixed material |
| Pot life | 30 | min | Typical mixed material |
After-processing / final-state properties
Typical cured-material properties for product evaluation. Values are reference data and are not product specifications; lap shear applies to the stated aluminum-to-aluminum test configuration and cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating temperature | −60 to 130 | °C | Documented product operating range |
| Hardness | 90 | Shore D | Typical cured material |
| Glass transition temperature (Tg) | 115 | °C | Typical cured material |
| Coefficient of expansion | 5.5 × 10−5 | cm/cm/°C | Typical cured material |
| Volume resistivity | 6 × 1013; 1 × 1010 | Ω·cm | At 25°C; at 100°C |
| Dielectric strength | 415 | V/mil | Typical cured material |
| Dielectric constant / dissipation factor | 4.5 / 0.01 | — | At 1 kHz |
| Lap shear strength | 17 | N/mm² | Aluminum-to-aluminum; 2,500 psi equivalent; sample cured 1 h at 65°C |
