LINQSOL EMC-1533 | Black Epoxy Molding Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Green molding compound
- Designed for transistor outline (TO) and double decawatt (D2PAK) packages
- Excellent workability, low water absorption, low modulus, and excellent thermal stability
Product Description
LINQSOL™ EMC-1533 is a halogen-free epoxy molding compound tailored for transistor Outline (TO) and D²PAK devices. Its low modulus minimizes package stress while maintaining a high glass-transition temperature of 170 °C for thermal stability. Its excellent flow characteristics enable smooth transfer molding. The compound also meets UL 94 V-0 flammability, ensuring robust safety margins. EMC-1533 boasts of its cost effectiveness and excellent workability with more than 500 continuous mold shots.
LINQSOL™ EMC-1533 guarantees strong performance and outstanding long-term reliability in demanding environments. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOL™ EMC-1533 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.
LINQSOL™ EMC-1533 is available in pressed pellets in a wide range of sizes to meet specific customer needs. Contact us for more product information, custom sizes, or other specific requirements.
Key Features
- Low Modulus, Low Stress: Reduces package warpage and wire-bond strain during thermal cycling.
- High Tg 170 °C: Maintains mechanical strength at elevated junction temperatures.
- Excellent Flowability: Fast 20 s gel time @ 175 °C supports high-yield transfer molding.
- UL 94 V-0 Flame Rating: Ensures self-extinguishing behavior for consumer and industrial safety.
- Halogen-Free & RoHS/REACH-Compliant: Avoids regulated substances for global market acceptance.
- Proven Reliability: Passes 500 h HTRB, 98 h PCT and 500 thermal cycles for long-term durability.
Designed for
- TO-220 (single & multi-lead power transistors, IGBTs)
- TO-252 / DPAK (surface-mount MOSFETs, regulators)
- TO-263 / D²PAK (high-current MOSFETs, Schottky diodes)
- TO-247 (high-voltage discrete devices, rectifiers)
Reliability Tests Passed
- HTRB, Tₐ=125°C, V=80%VR * 500 hour
- PCT, Tₐ=121°C, P=0.215atm, RH=100%* 98 hours
- Thermal Cycling Test, -55°C - +150°C * 500 cycles
LINQSOL™ EMC-1533 closely matches Hysol GR300, which shares a 170 °C Tg, 125 MPa flexural strength, and similar flow/gel characteristics, making it a practical drop-in alternative.
LINQSOL EMC-1533
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TDS, SDS & Technical Documents
Technical Specifications
General Properties
Electrical Properties
Thermal Properties
Mechanical Properties
Chemical Properties
Physical Properties
Additional Information
Recommended Mold Parameters
| Parameter | Value | Unit |
|---|---|---|
| Molding temperature | 170–190 | °C |
| Transfer pressure | 40–90 | kg/cm³ |
| Transfer time | 10–25 | sec |
| Cure time at 175 °C | 1.5–2 | min |
| Post mold cure time at 175 °C | 6-12 | h |
| Post mold cure time at 190 °C | 4-6 | h |
To achieve the best results, test the recommended conditions on the mold. Users should conduct their own testing to ensure it meets their specific needs and application.
Processing Instructions
- Before use, let LINQSOL EMC-1533 reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
- Use the materials within 72 hours after removing the container from cold storage.
Storage and Handling
LINQSOL EMC-1533 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life at 5 °C is 183 days.
