LINQBOND DA-8060S | Sintering Die-Attach
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- PFAS free
- Low Resin Bleed-Out (RBO)
- High thermal conductivity and adhesion to various leadframes
Product Description
LINQBOND DA-8060S is a single-component, pressure-less silver sintering die attach adhesive, known for its exceptional adhesion, high thermal conductivity, and high reliability. It performs excellently with various leadframes types, including Ag-spot plated, bare copper, PPF, and ceramic. Additionally, LINQBOND DA-8060S boasts exceptional workability and low Resin bleed out properties, making it ideal for high-volume semiconductor packaging applications.
LINQBOND DA-8060S is typically used as die attach for high power applications such as 5G, EVs, Industrial , Consumer electronics, Telecommunications, Aerospace, Defense and semiconductor packages such as SIP, QFN, LGA and HBLED.
Cure Schedule
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Ramp to 130°C and hold for 30 min + ramp to 220°C and hold for 90 min
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Ramp rate 5°C/min
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LINQBOND DA-8060S
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