LINQALLOY SP-SAC0307 | Solder paste

LINQALLOY SP-SAC0307 is a lead free, no clean, solder paste, comprised of 99% tin, 0.3% silver, 0.7% copper that has been designed for Surface Mount Technology(SMT). No-Clean Solder Paste is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues.

LINQALLOY-SP-SAC0307 solder paste is crafted with refined tin powder that allows for exceptional printing capabilities and minimal oxide content. This solder paste has enhanced flux content (higher %) that guarantees higher reliability. With its low iconic activator system it leaves behind minimal residues post reflow resulting in exceptionally high insulation resistance and excellent reliability