LAIRD TPUTTY SF560
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 5.6 W/m-K Non-Silicone Putty
- 60 g/min Cartridge Flow
- Low-Fogging Reworkable Interface
Product Description
Tputty SF560 Non-Silicone Thermal Gap Filler is a single-component, dispensable putty for low-force thermal interfaces in silicone-sensitive electronics. The ceramic-filled material provides 5.6 W/(m K) thermal conductivity and flows through cartridge dispensing systems for direct interface placement. Its compliant, reworkable form fills irregular gaps while a 0.15 mm minimum bondline supports close component-to-hardware contact. The -40 to 150 deg C operating range, low outgassing, and 99 percent fogging result support automotive and optical-adjacent applications. Applications include ADAS cameras, radar and lidar modules, ECUs, automotive displays, semiconductors, power electronics, consumer electronics, telecommunications equipment, and optical fiber assemblies.
Key features
- 5.6 W/(m K) Non-Silicone Putty: Ceramic-filled material supports high thermal transfer without silicone.
- 60 g/min Cartridge Flow: The one-part putty is formulated for controlled dispensing from cartridge systems.
- Low-Fogging Reworkable Interface: Compliant material supports low-force placement and later removal when required.
Applications / Suitable for
- ADAS cameras, radar, and lidar modules
- ECUs and automotive displays
- Semiconductors and power electronics
- Telecommunications and optical fiber equipment
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied dispensing and handling properties for Tputty SF560.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Ceramic-filled non-silicone dispensable gap filler | Single component | |
| Color | White-grey | Visual | |
| Flow rate | 60 | g/min | 75 cc cartridge at 90 psi |
| Density | 3.4 | g/cc | Helium pycnometer |
| Shelf life | 6 | months | Specified shelf life |
| Package formats | 30 to 600 | cc | Syringes and cartridges |
| Bulk packages | 1 and 5 | gallon | Pail formats |
After-processing / final-state properties
Typical installed-interface properties for Tputty SF560; results depend on bondline, pressure, and assembly geometry.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 5.6 | W/(m K) | Hot Disk |
| Minimum bondline thickness | 0.15 | mm | Laird method |
| Operating temperature range | -40 to 150 | deg C | Specified operating range |
| Dielectric breakdown voltage | 6 | kV | 1 mm specimen; ASTM D149 |
| Volume resistivity | 4 x 10^14 | ohm cm | ASTM D257 |
| Fogging | 99 | % | 100 deg C for 3 hours; ISO 6452:2021 |
| Outgassing TML / CVCM | 0.03 / 0.01 | % | ASTM E595 |
