LAIRD TPUTTY 506
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- No-Cure Single-Part Putty
- 3.5 W/m-K Thermal Conductivity
- Low-Pressure Uneven-Gap Filling
Product Description
Tputty 506 Thermal Gap Filler Putty is a soft, single-part silicone material for dispensing into large and uneven electronic thermal gaps without a cure step. Its ceramic-filled formulation provides 3.5 W/(m K) thermal conductivity while transferring little pressure between mating surfaces. The putty is more viscous than grease and uses specialized rheology for controlled flow under pressure, supporting application through dispensing equipment. A minimum bondline thickness of 0.1 mm and a -45 to 200 deg C operating range support varied interface geometries. Applications include microprocessors, graphics chips, automotive electronics, and LED lighting assemblies.
Key features
- No-Cure Single-Part Putty: The dispensable silicone material fills large and uneven gaps without curing.
- 3.5 W/(m K) Thermal Conductivity: Ceramic-filled putty transfers heat while remaining soft and compliant.
- Low-Pressure Uneven-Gap Filling: Specialized rheology supports controlled flow with little pressure transfer.
Applications / Suitable for
- Microprocessors and graphics chips
- Automotive electronics
- LED lighting assemblies
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied dispensing and material properties for Tputty 506.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Ceramic-filled dispensable silicone putty | Single-part; no cure required | |
| Color | Turquoise | Visual | |
| Flow rate | 17.2 | cc/min | 75 cc taper tip; 0.125 inch orifice; 90 psi |
| Density | 1.71 | g/cc | Helium pycnometer |
| Filler abrasiveness | 2 | Mohs | Predominant filler |
| Available packages | 75, 180, 360, 600 | cc | Dispensing cartridges |
| Bulk package | 20 | kg | Pail |
After-processing / final-state properties
Typical installed-interface properties for the non-curing Tputty 506 material.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 3.5 | W/(m K) | Hot Disk |
| Operating temperature range | -45 to 200 | deg C | Specified operating range |
| Minimum bondline thickness | 0.1 | mm | 0.004 inch |
| Volume resistivity | 1.8 x 10^14 | ohm cm | Typical bulk property |
| Outgassing TML | 0.46 | % by weight | ASTM E595 |
| Coefficient of thermal expansion | 227 | ppm/K | Volume dilatometry |
| Glass transition temperature | less than -90 | deg C | ASTM E1356 |
| Flammability | V-0 | UL 94 |
