LAIRD TPCM780SP
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- Screen-Printable Non-Silicone Paste
- 5.4 W/m-K Dry-State Conductivity
- 25 Micrometer Minimum Bondline
Product Description
Tpcm 780SP Screen-Printable Phase Change TIM is a grey, non-silicone paste for screen printing or stencil application onto electronic thermal interfaces. The thixotropic material contains a processing solvent that supports wetting, then dries firm to the touch after evaporation. In the dry state it provides 5.4 W/(m K) bulk thermal conductivity, softens from approximately 45 to 70 deg C, and can reach a 25 micrometer minimum bondline under pressure. The printable format supports manual or automated deposition without handling pre-cut pads. Applications include graphics cards, notebook and desktop computers, servers, IGBTs, automotive electronics, memory modules, and game consoles.
Key features
- Screen-Printable Non-Silicone Paste: Thixotropic paste supports screen, stencil, and automated deposition.
- 5.4 W/(m K) Dry-State Conductivity: The material develops its stated thermal properties after solvent evaporation.
- 25 Micrometer Minimum Bondline: Phase-change softening supports thin interface formation under pressure.
Applications / Suitable for
- Graphics cards and notebook computers
- Desktop computers and servers
- IGBT and automotive electronics
- Memory modules and game consoles
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied paste and handling properties for Tpcm 780SP.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Filled non-silicone paste | Screen-printable or stencilable | |
| Color | Grey | Visual | |
| Viscosity | 35 | Pa-s | 25 deg C; rheometer |
| Brookfield viscosity | 50,000 to 100,000 | cP | 25 deg C; spindle TD; 10 rpm |
| Package size | 0.5 or 1.0 | kg | Manual or automated printing |
| Storage | 15 to 35 | deg C | Maximum 50% RH; lid tightly closed |
| Shelf life | 1 | year from mix date | Stored under stated conditions |
After-processing / final-state properties
Typical properties after solvent evaporation; dry for 2 hours at 60 deg C or 8 hours at room temperature before evaluation.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Bulk thermal conductivity | 5.4 | W/(m K) | Hot Disk |
| Thermal resistance | 0.120 / 0.085 | C-cm^2/W | 10 psi / 50 psi at 70 deg C; ASTM D5470 |
| Operating temperature range | -40 to 125 | deg C | Laird test method |
| Softening temperature range | approximately 45 to 70 | deg C | Laird test method |
| Minimum bondline thickness | 25 | micrometers | Laird test method |
| Dielectric constant | 22.3 / 22.9 | 1 kHz / 1 MHz; ASTM D150 | |
| Volume resistivity | 1.5 x 10^13 | ohm cm | ASTM D991 |
| Flammability | V-0 | UL 94 |
