LAIRD TFLEX SF10.0.50
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 0.50 mm Thin-Gap Format
- 10.2 W/m-K Thermal Conductivity
- Non-Silicone Electrical Insulation
Product Description
Tflex SF10 0.50 mm Non-Silicone Thermal Gap Filler is a 229 x 229 mm ceramic-filled thermoplastic sheet for thin thermal interfaces in silicone-sensitive electronics. The 0.50 mm unreinforced construction provides 10.2 W/(m K) thermal conductivity and low thermal resistance while requiring limited pressure for surface contact. Its electrical insulation and -40 to 125 deg C operating range support controlled placement between heat-generating components and heat spreaders or housings. The material is supplied without fiberglass reinforcement and meets RoHS and REACH requirements. Applications include compact electronic assemblies that need a thin, non-silicone thermal gap-filling layer.
Key features
- 0.50 mm Thin-Gap Format: The 229 x 229 mm sheet provides a controlled thin interface without fiberglass reinforcement.
- 10.2 W/(m K) Thermal Conductivity: Ceramic-filled thermoplastic supports heat transfer across compact component gaps.
- Non-Silicone Electrical Insulation: The formulation combines silicone-free handling with high volume resistivity.
Applications / Suitable for
- Compact component-to-housing interfaces
- Silicone-sensitive electronic assemblies
- Thin converted thermal pads
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Supplied 0.50 mm A18213-02 sheet configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Ceramic-filled non-silicone thermoplastic | No reinforcement carrier | |
| Color | Grey | Visual | |
| Nominal thickness | 0.50 | mm | 0.020 inch |
| Sheet size | 229 x 229 | mm | 9 x 9 inch sheet |
| Density | 3.7 | g/cc | Helium pycnometer |
| Shelf life | 2 | years from shipment | Specified shelf life |
After-processing / final-state properties
Typical functional properties for the 0.50 mm A18213-02 configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 10.2 | W/(m K) | Hot Disk |
| Thermal resistance at 10 psi | 0.05 | C-in2/W | 10 psi applied pressure |
| Thermal resistance at 30 to 50 psi | 0.04 | C-in2/W | 30 to 50 psi applied pressure |
| Operating temperature range | -40 to 125 | deg C | Laird test method |
| Dielectric constant | 9 | 1 MHz; ASTM D150 | |
| Volume resistivity | 1 x 10^14 | ohm cm | ASTM D257 |
| Outgassing TML / CVCM | 0.33 / 0.15 | % | ASTM E595 |
