LAIRD TFLEX HD91000
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 1.00 mm Controlled-Compression Pad
- 7.5 W/mK Thermal Conductivity
- 0.20 C-in2/W at 10 psi
Product Description
Tflex HD91000 High-Deflection Thermal Gap Filler is a 1.00 mm grey ceramic-filled silicone sheet for low-pressure thermal contact across component-height variation. The HD90000 material combines 7.5 W/(m K) thermal conductivity with Shore 00 hardness of 32 and controlled pressure-versus-deflection behavior. At this thickness, typical thermal resistance is 0.20 deg C-in2/W at 10 psi, with 13% deflection at the same pressure. Low outgassing and high volume resistivity support use in electrically sensitive assemblies. Applications include electronics, automotive modules, portable devices, routers, instrumentation, and other component-to-hardware thermal gaps.
Key features
- 1.00 mm High-Deflection Pad: The HD91000 configuration provides a 0.040 inch preformed interface layer.
- 7.5 W/(m K) Thermal Conductivity: High bulk conductivity supports heat transfer across controlled assembly gaps.
- Low-Pressure Interface Response: Typical thermal resistance is 0.20 deg C-in2/W at 10 psi.
Applications / Suitable for
- Electronic component-to-heat-sink interfaces
- Automotive modules and portable electronics
- Routers, instrumentation, and wireless infrastructure
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied HD90000 material properties for the 1.00 mm Tflex HD91000 configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Ceramic-filled silicone sheet | Tflex HD90000 series | |
| Color | Grey | Visual | |
| Nominal thickness | 1.00 | mm | 0.040 inch product configuration |
| Density | 3.50 | g/cc | Helium pycnometer |
| Hardness | 32 | Shore 00 | ASTM D2240; 1000 um and above |
| Outgassing TML | 0.170 | % | ASTM E595 |
| Outgassing CVCM | 0.010 | % | ASTM E595 |
| Shelf life | 1 | year from shipment | Typical series property |
After-processing / final-state properties
Typical HD91000 thermal and deflection data at the stated pressures; interface performance depends on assembly geometry and compression.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 7.5 | W/(m K) | Hot Disk |
| Thermal resistance at 10 psi | 0.20 | deg C-in2/W | Typical 1.00 mm configuration |
| Thermal resistance at 30 psi | 0.08 | deg C-in2/W | Typical 1.00 mm configuration |
| Thermal resistance at 50 psi | 0.07 | deg C-in2/W | Typical 1.00 mm configuration |
| Deflection at 10 psi | 13 | % | Typical 1.00 mm configuration |
| Deflection at 50 psi | 68 | % | Typical 1.00 mm configuration |
| Operating temperature | -65 to 125 | deg C | Current product page |
| Dielectric constant | 8.10 | At 1 MHz |
