LAIRD TFLEX 660

Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other

LAIRD TFLEX 660

Main features

  • 1.50 mm Medium-Gap of Tflex 600 Series
  • 3.0 W/(m K) Thermal Interface
  • Easy Assembly and Placement with Naturally Tacky

Product Description

Tflex™ 660 is the 1.50 mm-thick configuration of the Tflex™ 600 Series, an exceptionally soft and highly compliant silicone thermal gap filler designed to bridge interfaces between heat-generating components and adjacent cooling surfaces. The blue-violet pad uses a boron nitride-filled silicone construction to provide typical thermal conductivity of 3.0 W/m·K. Its naturally tacky surfaces support placement during assembly without requiring an additional adhesive coating, making it suitable for applications requiring a medium-thickness thermal interface.

Key features

  • 1.50 mm nominal thickness: Specific Tflex™ 600 Series configuration for medium-gap thermal interface applications.
  • Highly compliant construction: Soft silicone gap filler conforms to uneven component and heat sink surfaces.
  • 3.0 W/m·K thermal conductivity: Boron nitride-filled silicone supports efficient heat transfer across the thermal interface.
  • Naturally tacky surfaces: Helps retain pad position during assembly without requiring an additional adhesive coating.

Applications / Suitable for

  • Automotive electronics, ADAS, infotainment, and ECU assemblies
  • Networking and telecommunications equipment
  • Industrial control and power electronics
  • Consumer electronics and embedded computing systems

Technical Specifications

General Properties
Color Color
Blue Violet
Component System Component System
Ceramic Filled Silicone Sheet
Density (g) Density (g)
1.34 g/cm3
Thickness range Thickness range
1.50 mm
Thermal Properties
Operating Temperature Operating Temperature
-45 to 200 °C
Thermal Conductivity Thermal Conductivity
3.0 W/m.K
UL 94 Rating UL 94 Rating
V0
Electrical Properties
Volume Resistivity Volume Resistivity
2 x 10^13 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical as-supplied properties of Tflex 6150 and its parent Tflex 600 Series. Values are provided for design guidance and are not guaranteed specifications.

Property Value Unit Method / condition
Construction and composition Ceramic-filled silicone sheet — Tflex 600 Series construction
Color Blue-violet — Visual
Nominal thickness 1.50 mm  Tflex 660 configuration; nominal uncompressed thickness
Density 1.30 g/cc Typical family-level value
Hardness 51 Shore 00 ASTM D2240
Surface condition Naturally tacky on both sides — Standard construction; one-side-tacky option is separately designated
Shelf life 2 years From date of shipment
Technical properties

After-processing / final-state properties

Typical family-level properties relevant to Tflex 6150 after placement within an assembled thermal interface. Installed performance varies with compression, final thickness, contact pressure, surfaces, and assembly design.

Property Value Unit Method / condition
Thermal conductivity 3.0 W/m·K ASTM D5470
Operating-temperature range -45 to 200 °C Documented Tflex 600 Series temperature range
Dielectric constant 3.3 — Typical family-level value; frequency not stated in the current product listing
Volume resistivity 2.0 × 1013 ohm·cm ASTM D257
Flammability rating V-0 — UL 94; confirm listing scope for the specific thickness and construction

 

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