LAIRD TFLEX 6150

Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other

LAIRD TFLEX 6150

Main features

  • 3.75 mm Thickness of Tflex 600 Series
  • 3.0 W/(m K) Thermal Interface
  • Naturally Tacky Surfaces

Product Description

Tflex™ 6150 is the 3.75 mm-thick configuration of the Tflex™ 600 Series, an exceptionally soft and highly compliant silicone thermal gap filler designed to bridge interfaces between heat-generating components and cooling surfaces. The blue-violet pad uses a proprietary boron nitride filler to provide typical thermal conductivity of 3.0 W/m·K. Its naturally tacky surface supports placement during assembly without requiring an additional adhesive coating that could affect thermal-interface performance. :contentReference[oaicite:0]{index=0}

Key features

  • 3.75 mm nominal thickness: Tflex™ 6150 is the 3.75 mm configuration within the Tflex™ 600 Series.
  • Compliant thermal interface: Exceptionally soft construction supports conformity around component topography in low-stress assemblies.
  • 3.0 W/m·K thermal conductivity: Boron nitride-filled silicone construction supports heat transfer through the installed interface.
  • Naturally tacky surfaces: Requires no additional adhesive coating for placement during assembly.

Applications / Suitable for

  • Automotive electronics, ADAS, infotainment, and powertrain or ECU assemblies
  • Routers and wireless infrastructure
  • Notebooks, tablets, portable devices, gaming systems, and smart-home devices
  • Instrumentation and drone or satellite electronics

Technical Specifications

General Properties
Color Color
Blue Violet
Component System Component System
Ceramic Filled Silicone Sheet
Density (g) Density (g)
1.34 g/cm3
Thickness range Thickness range
3.75 mm
Thermal Properties
Operating Temperature Operating Temperature
-45 to 200 °C
Thermal Conductivity Thermal Conductivity
3.0 W/m.K
UL 94 Rating UL 94 Rating
V0
Electrical Properties
Volume Resistivity Volume Resistivity
2 x 10^13 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical as-supplied properties of Tflex 6150 and its parent Tflex 600 Series. Values are provided for design guidance and are not guaranteed specifications.

Property Value Unit Method / condition
Construction and composition Ceramic-filled silicone sheet — Tflex 600 Series construction
Color Blue-violet — Visual
Nominal thickness 3.75 (0.150) mm (in) Tflex 6150 configuration; nominal uncompressed thickness
Density 1.30 g/cc Typical family-level value
Hardness 51 Shore 00 ASTM D2240
Surface condition Naturally tacky on both sides — Standard construction; one-side-tacky option is separately designated
Shelf life 2 years From date of shipment
Technical properties

After-processing / final-state properties

Typical family-level properties relevant to Tflex 6150 after placement within an assembled thermal interface. Installed performance varies with compression, final thickness, contact pressure, surfaces, and assembly design.

Property Value Unit Method / condition
Thermal conductivity 3.0 W/m·K ASTM D5470
Operating-temperature range -45 to 200 °C Documented Tflex 600 Series temperature range
Dielectric constant 3.3 — Typical family-level value; frequency not stated in the current product listing
Volume resistivity 2.0 × 1013 ohm·cm ASTM D257
Flammability rating V-0 — UL 94; confirm listing scope for the specific thickness and construction

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