LAIRD TFLEX 6110
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 3 W/mK Thermal Conductivity
- Greater Than 90% Recovery
- Naturally Tacky Adhesive-Free Placement
Product Description
Tflex 6110 Thermal Gap Filler is a 0.110 inch (2.79 mm) boron-nitride-filled silicone elastomer pad for component-to-hardware thermal gaps. The soft, naturally tacky material combines 3 W/(m K) thermal conductivity with Shore 00 hardness of 25, supporting low-pressure contact without an added adhesive coating. It recovers to more than 90% of its original thickness after compression and remains electrically insulating. Applications include component-to-chassis cooling, storage drives, memory modules, heat-pipe assemblies, automotive control units, and telecommunications hardware.
Key features
- 3 W/(m K) Conductive Pad: Boron-nitride-filled silicone supports heat transfer across compressed electronic gaps.
- Greater Than 90% Recovery: The material returns toward its original thickness after low-pressure compression.
- Naturally Tacky Placement: Surface tack supports installation without an added adhesive coating.
Applications / Suitable for
- Cooling components to chassis or frames
- Storage drives, memory modules, and heat-pipe assemblies
- Automotive control units and telecommunications hardware
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical Tflex 600-series construction and mechanical properties for the 0.110 inch Tflex 6110 configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Boron-nitride-filled silicone elastomer | Tflex 600 series | |
| Nominal thickness | 0.110 | in | 2.79 mm Tflex 6110 configuration |
| Color | Blue-violet | Visual | |
| Density | 1.34 | g/cc | Helium pycnometer; unreinforced grade |
| Hardness | 25 | Shore 00 | ASTM D2240 |
| Tensile strength | 15 | psi | ASTM D412 |
| Elongation | 75 | % | ASTM D412 |
| Surface | Naturally tacky | No additional adhesive coating required |
After-processing / final-state properties
Typical Tflex 600-series thermal, recovery, electrical, and outgassing properties; interface resistance depends on thickness and assembly pressure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 3 | W/(m K) | Modified ASTM D5470 |
| Thickness recovery | Greater than 90 | % | After low-pressure compression |
| Operating temperature | -45 to 200 | deg C | Typical series range |
| Breakdown voltage | Greater than 5,000 | VAC | ASTM D149 |
| Volume resistivity | 2 x 10^13 | ohm cm | ASTM D257 |
| Dielectric constant | 3.31 | At 1 MHz; ASTM D150 | |
| Outgassing TML | 0.13 | % | Post-cured; ASTM E595 |
| Outgassing CVCM | 0.05 | % | Post-cured; ASTM E595 |
