LAIRD TFLEX 360

Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other

LAIRD TFLEX 360

Main features

  • 1.50 mm Gap-Filling Solution
  • 50% Deflection at 50 psi
  • 1.2 W/(m K) Thermal Interface

Product Description

Tflex™ 360 is the 1.50 mm-thick configuration of the Tflex™ 300 Series, a ceramic-filled silicone thermal gap filler designed to bridge air gaps between heat-generating components and adjacent heat sinks or enclosures. The light-green thermal interface material provides typical thermal conductivity of 1.2 W/m·K and deflects by more than 50% of its original thickness at 50 psi, enabling effective surface conformity while maintaining reliable thermal contact. Its compliant construction and low compression set make it well suited for electronics requiring a medium-thickness thermal interface.

Key features

  • 1.50 mm thermal gap filler: Specific thickness configuration within the Tflex™ 300 Series for medium-gap thermal interface applications.
  • Highly compliant material: Greater than 50% deflection at 50 psi helps maximize contact across uneven component surfaces.
  • Reliable thermal transfer: Typical thermal conductivity of 1.2 W/m·K with ceramic-filled silicone construction for electronics cooling.

Applications / Suitable for

  • Automotive electronics, ECUs, ADAS, and infotainment systems
  • Networking equipment and telecommunications hardware
  • Industrial electronics and power supplies
  • Consumer electronics requiring compliant thermal gap filling

Technical Specifications

General Properties
Color Color
Light Green
Component System Component System
Ceramic Filled Silicone Sheet
Density (g) Density (g)
1.78 g/cm3
Thickness range Thickness range
1.50 mm
Thermal Properties
Operating Temperature Operating Temperature
-40 to 160 °C
Thermal Conductivity Thermal Conductivity
1.2 W/m.K
Electrical Properties
Volume Resistivity Volume Resistivity
10^13 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical uninstalled properties and available dimensions for the Tflex 300 Series. Values are for design guidance and are not guaranteed specifications. :contentReference[oaicite:1]{index=1}

Property Value Unit Method / condition
Construction and composition Ceramic-filled silicone sheet — Product construction
Color Light green — Visual
Thickness range 1.50 mm Nominal uncompressed thickness range
Density 1.78 g/cc Helium pycnometer
Hardness 51.4 for 20–30 mil
25.2 for 40 mil and above
Shore 00 ASTM D2240; thickness-dependent result
Shelf life 2 years From date of shipment; storage conditions not stated on the product page
Technical properties

After-processing / final-state properties

Typical thermal, electrical, environmental, and installed-interface properties of Tflex 300. Values are not intended as guaranteed design limits. :contentReference[oaicite:2]{index=2}

Property Value Unit Method / condition
Thermal conductivity 1.2 W/m·K ASTM D5470
Thermal resistance 0.98 °C·in²/W Modified ASTM D5470; 40 mil thickness, 10 psi, 50°C
Deflection >50 % At 50 psi; thickness-specific curves are provided in the datasheet
Operating-temperature range -40 to 160 °C Documented product temperature range
Dielectric constant 4.5 — ASTM D150 at 10 GHz
Volume resistivity 1013 ohm·cm ASTM D257
Outgassing TML: 0.56
CVCM: 0.10
wt% ASTM E595
Flammability rating V-0 — UL 94

 

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