PI-6324-001 | Insulating Polyimide Ink
Harmonization Code : 32159090 | Printing ink, writing or drawing ink, and other inks, whether or not concentrated or solid, specifically for those classified as other within that category
Main features
- Thermal Curable
- Heat Resistance
- Low Temperature Curing
Product Description
PI-6324-001 is a polyimide insulating ink designed to provide thermally curable solution to heat resistance and electrical insulation, and replaces PI-6322-001. It is engineered to provide electrical insulation with its advanced polyimide formulation ensures that your components remain safeguarded against electrical currents, allowing your devices to perform flawlessly even in high-voltage applications. Featured with only 1% water absorbance, this ink stands strong against moisture-induced vulnerabilities, guaranteeing consistent performance even in humid environments. Moreover, with a tensile modulus of 1500 MPa, this ink enhances mechanical stability, making it an excellent choice for applications requiring both electrical insulation and structural integrity.
Industry Applications:
- Aerospace and Defense
- Electronics Manufacturing
- Industrial Sensors
JNC PI-6324-001
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TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Mechanical Properties
Chemical Properties
Physical Properties
Additional Information
| Properties | PI-6324-001 |
| Solids content (wt. %) | 24 |
| Viscosity (mPa) @25℃ | 11 |
| Surface Tension (mN/m) @23℃ | 28 |
| Printing Methods | Inkjet |
| Drying | 80℃, 5 min |
| Curing | 180℃ 120min |
| Post-Curing | - |
| Volume resistivity (Ω*cm) | 1E+16 |
| Breakdown voltage (V/um) | 100 |
| Dielectric constant (1kHz) @1V | 3.8 |
| Tensile modulus (MPa) | 1500 |
| Elongation (%) | 6 |
| Residual stress (MPa) | 14 |
| 5% weight loss temp (℃) | 370 |
| CTE ( | 75 |
| Tg (℃) | 250 |
| Water absorbance (%) @23℃ | 1.0 |
