JNC PI-6302-004 | Insulating Polyimide Ink
Harmonization Code : 3908900090 | Polyamides in Primary form
Main features
- Thermal Curable
- Low Temperature Curing
- High Heat Resistance
Product Description
PI-6302-004 is a low-temperature cured insulating polyimide ink specially designed to meet the demands of high thermal applications, which provide solution for heat resistance and insulation applications.
PI-6673-004 is engineered to be a thermally curable polyimide ink with remarkable insulating properties making it ideal choice for electrical isolation and heat management applications. Its polyimide-based chemistry brings forth the balance between flexibility and resilience. PI-6673-004 features a residual stress of 32 MPa and a coefficient of thermal expansion (CTE) of 65 ppm/K, ensuring compatibility with various materials and minimizing the risk of performance-altering mismatches. Moreover, with a breakdown voltage of 100 V/um and a dielectric constant of 2.8 @ 1 kHz, ensuring stable electrical isolation and signal integrity for your components.
Industry Applications:
Electronics Manufacturing | Consumer Electronics | Sensors and IoT Devices
Cure condition
- 230⁰C in 30 min
JNC PI-6302-004
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TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Mechanical Properties
Chemical Properties
Physical Properties
Additional Information
| Properties | PI-6302-004 |
| Solids content (wt. %) | 25 |
| Viscosity (mPa's) @25℃ | 6 |
| Surface tension (mN/m) @23℃ | 27 |
| Printing methods | Inkjet |
| Curing | 230℃ 30min |
| Post-curing | - |
| Volume resistivity (Ω*cm) | 1E+16 |
| Breakdown voltage (V/um) | 100 |
| Dielectric constant (1kHz) @1V | 3.5 |
| Tensile modulus (MPa) | 780 |
| Elongation (%) | 3 |
| Residual stress (MPa) | 32 |
| 5% weight loss temp (℃) | 390 |
| CTE ( | 65 |
| Tg (℃) | 255 |
| Water absorbance (%) @23℃ | 1.0 |
