Hysol KL-G100S | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Hysol KL-G100S | Black Epoxy Mold Compound

Main features

  • Low CTE (13 ppm/°C)
  • Low stress
  • For SOD, MBF, ABS packages

Product Description

Hysol KL-G100S is a black, semiconductor grade, high productivity molding compound, providing a wide operation window. It is 80% filled with spherical/fused silica and achieves a flammability rating of V0 at UL94 testing conditions.

Hysol KL-G100S is an environmentally friendly molding compound with high moldability that has a low coefficient of thermal expansion (13ppm/°C). It is typically used for SOD, MBF and ABS semiconductor packages. Its CTI, comparative tracking index value is 525V.

Technical Specifications

General Properties
Color Color
Black
Filler Content Filler Content
80 %
Specific Gravity Specific Gravity
1.89
Chemical Properties
Moisture absorption Moisture absorption
0.40 %
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
91.4 cm
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
153 °C
Thermal Conductivity Thermal Conductivity
0.74-1.07 W/m.K
UL 94 Rating UL 94 Rating
V0
Mechanical Properties
Molded Shrinkage Molded Shrinkage
0.25 %
Curing Conditions
Transfer Pressure Transfer Pressure
40 - 70 kg/cm2
Transfer Time Transfer Time
10 - 25 s

Additional Information

Additional Technical Information

Property Unit Temperature
25℃ 150℃ 175℃
Chlorine (Cl⁻) ppm 15
Sodium (Na⁺) ppm 4
Potassium (K⁺) ppm 1
Bromine (Br⁻) ppm 0
Sulfate (SO₄²⁻) ppm 1
Electrical Conductivity (oEW)
uS/cm 20 - -
Flexural Strength MPa 145 91 61
Flexural Modulus MPa 12,577 612 501
Adhesion Strength to Cu (Post-PMC)
MPa 0.90 1.14 1.02
Adhesion Strength to Cu (Post-MSL3)
MPa 0.40 0.17 0.12

 

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