FCT NL932HF
Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium
Main features
- Zero-Halide ROL0 Flux
- Extended Eight-Hour Stencil Life
- Multiple Lead-Free Alloy Options
Product Description
FCT NL932HF No-Clean Lead-Free Solder Paste is a zero-halide, zero-halogen lead-free solder paste for SMT printing and reflow. The no-clean flux system is classified ROL0 under J-STD-004 and is formulated for repeatable printing while minimizing graping during reflow. The paste provides more than 8 hours of stencil life and is described as stable at room temperature. Supported alloy families include SAC, SN100C, SN100CV, and LF-C2, covering fine-pitch and small-area-ratio assembly work together with stated high-reliability alloy options.
Key features
- Zero-halide ROL0 flux: The no-clean flux is classified ROL0 and has zero documented halide and halogen content.
- Extended stencil life: The paste provides more than 8 hours of stencil life under the documented conditions.
- Multiple lead-free alloy families: Supported configurations include SAC, SN100C, SN100CV, and LF-C2 alloy families.
Applications
- No-clean SMT solder-paste printing and reflow
- Fine-pitch and small-area-ratio apertures
- Assemblies using supported high-reliability alloy options
Technical Specifications
Other Properties
Additional Information
As-supplied / before-processing properties
Flux, classification, handling, and alloy data before reflow.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Flux type | No clean | - | As supplied |
| Flux classification | ROL0 | - | J-STD-004 |
| Halide and halogen content | Zero | - | stated for the flux system |
| Stencil life | > 8 | h | Under stated printing conditions |
| Room-temperature stability | Stable | - | Exact-product condition |
| Supported alloy families | SAC; SN100C; SN100CV; LF-C2 | - | Availability depends on alloy and powder configuration |
