FCT NL930PT
Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium
Main features
- ROL0 Zero-Halide Flux
- Eight-Hour Stencil Life
- Multiple Lead-Free Alloy Options
Product Description
FCT NL930PT No-Clean Lead-Free Solder Paste is a no-clean lead-free solder paste with pin-testable flux residue for SMT printing and reflow. The flux system is classified ROL0 and is stated with 0.0% halide ion and halogen content. Available alloy options include SAC305, SN100C, Sn96.5/Ag3.5, SN100CV, LF-C2, and anti-tombstoning mixtures in supported powder sizes. The paste is formulated for fine-pitch and small-area-ratio apertures, provides an 8 hour stencil life under the stated temperature and humidity conditions, and supports reflow within approximately 8 hours after printing.
Key features
- ROL0 zero-halide flux: The flux classification is ROL0 with 0.0% documented halide ion and halogen content.
- Eight-hour stencil life: The paste maintains a documented stencil life under controlled temperature and humidity.
- Multiple lead-free alloy options: Supported configurations include SAC305, SN100C, SN100CV, LF-C2, and Sn96.5/Ag3.5.
Applications
- Lead-free no-clean SMT solder-paste printing and reflow
Technical Specifications
Other Properties
Additional Information
As-supplied / before-processing properties
Flux, alloy, powder, stencil-life, and handling data before reflow.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Physical form | Paste | - | As supplied |
| Flux classification | ROL0 | - | J-STD-004B |
| Halide ion content | 0.0 | wt % | IPC 2.3.28.1 |
| Halogen content | 0.0 | wt % | EN 14582 and IPC 2.3.28.1 |
| Solder alloy options | SAC305; SN100C; Sn96.5/Ag3.5; SN100CV; LF-C2; anti-tombstoning mixtures | - | Powder size varies by alloy and configuration |
| Solder powder types | Type 3 or 4; Type 5 size range stated | - | Availability depends on alloy/configuration |
| Stencil life | 8 | h | At 18 to 29 deg C and 10 to 70% RH |
| Warm-up time | 3 to 4 | h | Sealed container to 18 to 29 deg C before use |
| Printed-board hold time | Approximately 8 | h | Reflow as soon as practical after printing |
