ELECTROLUBE TCOR
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 1.8 W/(m K) Thermal Conductivity
- One-Component 100% Solids Non-Slump RTV
- -50 to 230 deg C Operating Range
Product Description
Electrolube® TCOR is a single-component, 100% solids, low-odour silicone RTV formulated to improve heat transfer between electronic devices and heat sinks. The white, non-slump paste cures through exposure to atmospheric moisture and combines a thermal conductivity of 1.8 W/m·K with adhesive, sealing, and gasketing capabilities. Once cured, TCOR supports an operating temperature range of -50 to 230 °C, with a maximum operating temperature of 250 °C for 30 minutes. Its high-viscosity consistency allows controlled placement around components and power resistors where thermal dissipation and material retention are required.
Key features
- Thermally conductive: Provides a typical cured thermal conductivity of 1.8 W/m·K using the supplier's heat-flow measurement method.
- Single-component non-slump paste: Requires no component mixing and maintains its applied form during placement.
- Wide operating temperature range: Supports cured-material use from -50 to 230 °C, with short-term exposure to 250 °C for 30 minutes.
Applications / Suitable for
- Interfaces between electronic devices and heat sinks
- Thermal dissipation around electronic components
- Thermal management around power resistors
- Low-bond-strength thermal adhesive, sealant, or gasketing applications
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical properties of the single-component material before moisture cure. Skin formation and cure time depend on ambient temperature and humidity.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Color | White | — | As supplied |
| Viscosity | 140 to 150 | Pa·s | At 1 rpm; temperature and instrument not stated |
| Consistency | Non-slump paste | — | Single-component material |
| Density | 2.3 | g/mL | At 20 °C |
| Skin-forming time | 10 to 15 | minutes | Dependent on ambient temperature and humidity |
| Cure time | 24 | hours | At 20 °C; dependent on ambient temperature and humidity |
| Shelf life | 12 | months | Thermally conductive RTV (oxime); avoid storage above 30 °C and 50% RH |
After-processing / final-state properties
Typical properties of TCOR after moisture cure. Values describe cured bulk material and should not be interpreted as complete assembled-interface performance.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.8 | W/m·K | Cured material; supplier heat-flow method |
| Operating temperature range | -50 to 230 | °C | Cured material; retention of individual properties across the range is not stated |
| Maximum operating temperature | 250 | °C | Maximum exposure duration: 30 minutes |
| Shore hardness | A75 | Shore A | Cured material; test method not stated |
| Elongation at break | 300 | % | Cured material; test method not stated |
| Tensile strength | 2 | MPa | Cured material; test method not stated |
| Dielectric strength | >8 | kV/mm | Cured material; specimen thickness and test method not stated |
| Volume resistivity | 1 × 1014 | Ω·cm | Cured material; test method and conditioning not stated |
