LOCTITE ECCOBOND UF8830S
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High purity
- Improved toughness
- Good flow with self filleting
Product Description
LOCTITE® ECCOBOND UF 8830S liquid epoxy Capillary underfill is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.
LOCTITE® ECCOBOND UF 8830S achieves MSL L3/L2A and passes all reliability requirements, including automotive applications, without fillet cracks after 4000 cycles(TC -55/150°C). It demonstrates excellent wettability to different substrates, has a wide process window and is also compatible with pressure ovens. Its High Tg with its minimal shift ensures a stable performance for applications with high operating temperatures.
Cure Schedule
- 30 minute ramp from 25°C to 150°C, hold 2hrs at 150°C
ECCOBOND UF8830S
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General Properties
Thermal Properties
Physical Properties
Additional Information
What are the processing instructions for UF8830S?
Substrate heating 100 °C
UF 1173 & UF 8830S Dk and Df @ 80GHz
Terms permittivity (Dk) and loss tangent (Df) for UF 8830S - Open ended coaxial probe
