DOWSIL SE 9184

Harmonization Code : 3215907090 | Ink, whether or not concentrated or solid (excl. printing ink, printer/copier ink cartridges incorporating mechanical or electrical components, and solid ink in engineered shapes for printers/copiers)

DOWSIL SE9184

Main features

  • Fast Tack-Free Rt Cure
  • Non-Sag Placement Control
  • Thermally Conductive Thermal Bonding

Product Description

DOWSIL™ SE 9184 RTV Adhesive is a one-part, non-flowing, thermally conductive RTV silicone adhesive designed to provide both adhesion and heat transfer for cooling electrical and electronic components. The moisture-cure material offers fast tack-free performance at room temperature without requiring mixing or oven curing, helping support efficient assembly processes. Its thermally conductive formulation, controlled silicone volatility, and UL 94 V-0 flammability classification make it suitable for applications where thermal management and flame resistance are important considerations. The cured elastomer provides durable adhesion while maintaining electrical insulation properties.

Key features

  • Fast room-temperature cure: Tack-free in approximately 3 minutes with no mixing or oven curing required.
  • Thermal conductivity: Thermal conductivity of 0.84 W/m·K supports heat transfer from electronic components to thermal management systems.
  • Flame-resistant formulation: UL 94 V-0 classification and controlled silicone volatility support demanding electronic assembly environments.

Applications / Suitable for

  • Thermal management of electrical and electronic components
  • Bonding applications requiring heat dissipation
  • PCB system assemblies
  • Consumer electronic devices with compact designs
  • Applications requiring thermal transfer and added flame resistance

Technical Specifications

General Properties
Color Color
White
Component System Component System
One
Specific Gravity Specific Gravity
2.2
Physical Properties
Tack-Free Time Tack-Free Time
3 minutes
Mechanical Properties
Elongation Elongation
60 %
Thermal Properties
Thermal Conductivity Thermal Conductivity
0.84 W/m.K
Electrical Properties
Dielectric Strength Dielectric Strength
20 kV/mm
Volume Resistivity Volume Resistivity
1.5 x 10¹⁵ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties of the adhesive before cure and processing. Values are typical data and not intended as specifications.

Property Value Unit Method / condition
Product type One-part - As supplied
Color White - As supplied
Non-volatile content 98.9 % Typical value
Tack-free time 3 minutes 25°C
Physical form Paste - SDS appearance data
Technical properties

After-processing / final-state properties

Typical cured properties. Values are typical data and not intended as specifications.

Property Value Unit Method / condition
Thermal conductivity 0.84 W/m·K Typical cured property
Tensile strength 3.2 MPa Typical cured property
Elongation 60 % Typical cured property
Hardness 74 Shore A JIS standard
Lap shear adhesion to aluminum 1.7 MPa Unprimed adhesion
Dielectric strength 20 kV/mm Typical cured property
UL flammability classification 94 V-0 - UL classification

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