DOWSIL EA9189H
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys
Main features
- 2-Minute Tack-Free Time
- 28 kV/mm Dielectric Strength
- Multi-Substrate Lap-Shear Data
Product Description
DOWSIL EA-9189 H White RTV Adhesive is a one-part, white alkoxy-cure RTV silicone adhesive for module assembly bonding. The ready-to-use material requires no mixing and reaches a typical tack-free state in 2 minutes at 25 deg C. It can be dispensed manually or with automated equipment and moisture-cures at room temperature, with mild heat below 60 deg C available to accelerate cure. The cured adhesive combines 3.9 MPa tensile strength, Shore A 80 hardness, 28 kV/mm dielectric strength and 0.88 W/(m K) thermal conductivity. Unprimed lap-shear values are 2.2 MPa on aluminum, 2.3 MPa on copper, 1.2 MPa on polycarbonate and 2.4 MPa on FR-4, and the exact product carries UL 94 V-0 classification.
Key features
- 2-minute tack-free time: Provides rapid surface cure at 25 deg C.
- Multi-substrate lap-shear data: Typical values are reported for aluminum, copper, polycarbonate and FR-4.
- Electrical and thermal properties: Cured data include 28 kV/mm dielectric strength and 0.88 W/(m K) thermal conductivity.
Applications
Module assembly bonding and sealing where a one-part white RTV silicone adhesive is specified.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied and surface-cure characteristics. Tack-free time does not represent full cure. Values are not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component count | One | As supplied | |
| Color | White | As supplied | |
| Cure system | Alkoxy moisture cure | Room-temperature RTV | |
| Tack-free time | 2 | minutes | At 25 deg C |
| Application method | Manual or automated dispensing | Ready to use |
After-processing / final-state properties
Typical cured properties. Lap-shear values are substrate-specific. Values are not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Specific gravity | 1.68 | Cured | |
| Tensile strength | 3.9 | MPa | Cured material |
| Elongation | 32 | % | Cured material |
| Durometer hardness | 80 | Shore A | Cured material |
| Unprimed lap shear to aluminum | 2.2 | MPa | Substrate-specific |
| Unprimed lap shear to copper | 2.3 | MPa | Substrate-specific |
| Unprimed lap shear to polycarbonate | 1.2 | MPa | Substrate-specific |
| Unprimed lap shear to FR-4 | 2.4 | MPa | Substrate-specific |
| Thermal conductivity | 0.88 | W/(m K) | Cured material |
| Volume resistivity | 3.3E+15 | ohm cm | Cured material |
| Dielectric strength | 28 | kV/mm | Cured material |
| Dielectric constant | 2.59 | At 100 kHz | |
| Dissipation factor | 0.009 | At 100 kHz | |
| UL flammability classification | 94 V-0 | Exact product |
