DEVCON 10 MINUTE EPOXY
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 10-Minute Working Window
- 1:1 Meter-Mix Processing
- 31.5 kV/mm Dielectric Strength
Product Description
Devcon® 10 Minute™ Epoxy is a rapid-curing, two-part epoxy adhesive and encapsulant for industrial bonding applications. The 100%-solids, solvent-free system bonds metals, fabrics, ceramics, glass, wood, and concrete in compatible combinations. It features a 1:1 mix ratio by volume or weight, a 10-minute working time, and a functional cure in 1.5 hours at room temperature. Available in black and clear versions, it provides rigid cured performance with documented mechanical and electrical properties.
Key features
- Rapid-curing epoxy system: Provides a 10-minute working time, 20-minute fixture time, and 1.5-hour functional cure.
- Convenient 1:1 mixing: Resin and hardener mix at a 1:1 ratio by either volume or weight.
- Multi-material bonding: Bonds metals, fabrics, ceramics, glass, wood, and concrete in compatible combinations.
Applications / Suitable for
- General-purpose industrial bonding
- Encapsulation of industrial components
- Bonding compatible combinations of metals, fabrics, ceramics, glass, wood, and concrete
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Mechanical Properties
Electrical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical uncured and processing properties of Devcon® 10 Minute™ Epoxy at 72 °F (23 °C), except where otherwise noted. Typical technical data are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Color | Black or clear | — | Uncured at 72 °F (23 °C) |
| Mix ratio | 1:1 | — | By volume or weight |
| Mixed viscosity | 80,000–90,000 | cP | Uncured at 72 °F (23 °C) |
| Mixed density | 9.4 (1.13) | lb/gal (g/cm³) | Uncured at 72 °F (23 °C) |
| Working time | 10 | minutes | Uncured at 72 °F (23 °C) |
| Fixture time | 20 | minutes | Uncured at 72 °F (23 °C) |
| Functional cure | 1.5 | hours | At 72 °F (23 °C) |
| Full cure | 12 | hours | At 72 °F (23 °C) |
| Solids by volume | 100 | % | Typical |
After-processing / final-state properties
Typical cured properties of Devcon® 10 Minute™ Epoxy after seven days at 75 °F (24 °C). Typical technical data are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Adhesive lap shear | 2,400 (16.55) | psi (MPa) | ASTM D1002; cured 7 days at 75 °F (24 °C) |
| Hardness | 75 | Shore D | ASTM D2240; cured 7 days at 75 °F (24 °C) |
| Dielectric strength | 800 (31.5) | V/mil (kV/mm) | ASTM D149; cured 7 days at 75 °F (24 °C) |
| Impact resistance | 10 (21) | ft-lb/in² (kJ/m²) | Cured 7 days at 75 °F (24 °C); test method not stated |
| Tensile elongation | 5 | % | Cured 7 days at 75 °F (24 °C); test method not stated |
| T-peel strength | 20–25 (3.5–4.4) | pli (N/mm) | Cured 7 days at 75 °F (24 °C); test method not stated |
| Service temperature | -40 to 200 (-40 to 93) | °F (°C) | Documented service-temperature range |
