CNP OM5100
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Low-Residue No-Clean Processing
- First-Pass Assembly Yield Support
- Configurable SMT Process Fit
Product Description
ALPHA OM-5100 Solder Paste is a low-residue, no-clean solder paste for surface-mount PCB assembly. The product is formulated for first-pass assembly yield while leaving limited residue after reflow, reducing the need for a separate cleaning step in no-clean processes. It is available in different alloy, powder-size, metal-load and package combinations for specific print and reflow requirements. These configuration options make the paste suitable for surface-mount production using the alloy, powder and reflow profile selected for the assembly.
Key features
- Low-Residue No-Clean Flux: limits post-reflow residue for assembly processes that do not use a separate cleaning step
- First-Pass Yield Focus: is formulated for first-pass surface-mount assembly yield
- Configurable SMT Format: offers alloy, powder-size, metal-load and package options for different assembly requirements
Applications
Surface-mount PCB assembly using the alloy, powder and reflow profile selected for the process.
