CNP OM350
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Fine-feature no-clean solder paste with demonstrated Pin-in-Paste performance and robust solderability across OSP-Cu, Immersion Ag, Immersion Sn, ENIG, and lead-free HASL finishes.
- Greater than 6-hour stencil life at 25 °C with stable storage and handling performance up to 30 °C for 21 days.
- Halide-free ROL0 formulation with IPC Class III voiding performance and documented SIR and electromigration reliability results.
Product Description
ALPHA OM-350 Solder Paste is a lead-free, no-clean solder paste designed for fine-feature printing and demanding SMT reflow processes in air or nitrogen. Its broad reflow process window supports soldering on OSP-Cu, Immersion Ag, Immersion Sn, ENIG, and lead-free HASL surface finishes, including applications involving CSP and QFN components. ALPHA OM-350 combines stable paste viscosity with long stencil life and high tack force to support consistent printing and pick-and-place performance. The halide-free formulation is classified ROL0 according to IPC J-STD-004 and meets IPC Class III voiding performance.
Key features
- Fine-feature and Pin-in-Paste capability: Supports fine-feature printing and demonstrated Pin-in-Paste performance for printing, dispensing, or pin-transfer SMT applications.
- Long stencil life and stable viscosity: Provides greater than 6 hours of stencil life at 25 °C and stable handling up to 30 °C for 21 days.
- Wide reflow process window: Supports straight-ramp and soak profiles in both air and nitrogen across multiple lead-free board finishes.
- Controlled voiding and solder balling: Meets IPC Class III voiding performance and is formulated to reduce random solder ball levels.
Applications / Suitable for
- Fine-feature SMT stencil printing
- Pin-in-Paste / Paste-in-Hole assembly
- High-density PWB assemblies
- Assemblies using CSP and QFN components
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
Selected properties and available configurations of ALPHA OM-350 before reflow.
| Property | Value | Method or condition |
|---|---|---|
| Available alloys | SAC305, SACX Plus 0307, Innolot, 5Sn92.5Pb2.5Ag | Other Sn-Ag-Cu alloys available upon request |
| Powder size | Type 3, Type 4, Type 5 | Available configurations |
| Flux residue | Approximately 5% | By weight |
| Flux classification | ROL0 | IPC J-STD-004 |
| Halide content | Halide free | By titration and IC, IPC J-STD-004 |
| Metal content - Type 4 | 89.0% | M16 designation; Malcom Spiral Viscometer, JIS Z 3284 Annex 6 |
| Metal content - Type 5 | 88.8% | M16 designation; Malcom Spiral Viscometer, JIS Z 3284 Annex 6 |
| Stencil life | >6 hours | 25 °C (77 °F) |
After-processing / final-state properties
Selected electrical reliability and soldering performance results for ALPHA OM-350 under the stated test conditions.
| Property | Result | Method or condition |
|---|---|---|
| IPC SIR | Pass, 1.8 x 1010 ohms | IPC J-STD-004; 168 hours at 85 °C/85% RH; pass >=1 x 108 ohm |
| Bellcore SIR | Pass, 1.9 x 1012 ohms | Bellcore GR78-CORE; 96 hours at 35 °C/85% RH; pass >=1 x 1011 ohm |
| Electromigration | Pass; initial 7.8 x 108 ohms, final 8.2 x 109 ohms | Bellcore GR78-CORE; 10 V, 500 hours; pass = final > initial/10 |
| HP ECM test | Pass; no migration after 28 days | 50 °C/90% RH, 5 V; Cu/ImmAg/ImmSn finishes; Hewlett-Packard EL-EN861-00 |
| Copper corrosion | Pass | IPC J-STD-004 and JIS Z 3197:1986 |
| Voiding performance | Class III | IPC voiding classification |
