CNP OM338T
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Ultra-fine feature solder paste supporting full alloy coalescence on circular dimensions as small as 0.25 mm with a 0.100 mm stencil.
- High-throughput printing at speeds up to 200 mm/s with greater than 8-hour stencil life at 50% RH and 23 °C.
- ROL0, halide-free no-clean formulation with IPC-7095 Class III voiding performance and documented electrical reliability.
Product Description
ALPHA OM-338-T Ultra Fine Feature Lead-Free Solder Paste is a lead-free, no-clean solder paste designed for standard and fine-pitch stencil printing across a broad range of electronics assembly applications. Also identified as ALPHA OM-338 with M13 viscosity, it combines ultra-fine feature repeatability with a broad processing window and print speeds up to 200 mm/s. The paste provides good solderability on CuOSP and other board and component finishes, with resistance to random and mid-chip solder balling. ALPHA OM-338-T is ROL0 classified, halide-free, compatible with air or nitrogen reflow, and meets IPC-7095 Class III voiding performance.
Key features
- Ultra-fine feature capability: Supports full alloy coalescence on circular dimensions as small as 0.25 mm (0.010 in) using a 0.100 mm (4 mil) stencil.
- High-throughput printing: Supports print speeds from 25 to 200 mm/s (1 to 8 in/s) with stencil life greater than 8 hours at 50% RH and 23 °C.
- Wide reflow process window: Provides good solderability across various board and component finishes and is compatible with clean-dry air or nitrogen reflow.
- Controlled voiding and solder balling: Meets IPC-7095 Class III voiding performance and is designed to reduce random solder balling.
Applications / Suitable for
- Standard and fine-pitch stencil printing
- Ultra-fine feature electronics assembly
- High-throughput SMT processing
- Lead-free assembly using air or nitrogen reflow
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
Selected properties and available configurations of ALPHA OM-338-T before reflow.
| Property | Value | Method or condition |
|---|---|---|
| Available alloys | SAC305, SAC387, SAC396, SAC405, SACX Plus 0307, SACX Plus 0807 | e1 alloys per JESD97 Classification |
| Powder size | Type 3 (25-45 µm); Type 4 by special request | Type 3 per IPC J-STD-005; technical data developed using Type 3 powder |
| Metal load | 88.5% | OM-338-T M13 viscosity designation for printing |
| Flux classification | ROL0 | IPC J-STD-004A |
| Halide content | Halide free | By titration; passes Ag Chromate Test, IPC J-STD-004A |
| Stencil life | >8 hours | 50% RH, 23 °C (74 °F) |
After-processing / final-state properties
Selected electrical reliability and soldering performance results for ALPHA OM-338-T under the stated test conditions.
| Property | Result | Method or condition |
|---|---|---|
| SIR | Pass, >1.9 x 1010 ohms | IPC J-STD-004A; 7 days at 85 °C/85% RH; pass >=1 x 108 ohm |
| SIR | Pass, 8.3 x 1012 ohms | Bellcore GR78-CORE; 96 hours at 35 °C/85% RH; pass >=1 x 1011 ohm |
| Electromigration | Pass; initial 5.3 x 1010 ohms, final 1.5 x 1011 ohms | Bellcore GR78-CORE; 65 °C/85% RH, 10 V, 500 hours; pass = final > initial/10 |
| Voiding performance | Class III | IPC-7095 voiding performance classification |
| Copper corrosion | Pass, no evidence of corrosion | IPC J-STD-004A |
