ALPHA WS826

ALPHA WS-826 Solder Paste is a water-soluble, lead-free, zero-halogen solder paste developed for SAC305 assembly in air or nitrogen reflow. Type 4 and Type 5 powder options support fine-pitch printing, while the formulation maintains an eight-hour stencil life at both 25 deg C/50% RH and 30 deg C/70% RH. Its flux is classified ORM0 to IPC J-STD-004B, with no halides or halogens detected by the cited methods. Cold- and hot-slump testing passed without bridging above 0.20 mm and 0.25 mm, respectively. Residues are designed for hot deionized-water removal in batch or inline equipment after one or two reflow cycles. Properly stored unopened paste has a six-month shelf life at 0-10 deg C.

Key features

• High-humidity stencil stability: Maintains eight-hour transfer efficiency at 30 deg C and 70% RH.
• Air or nitrogen reflow: Supports SAC305 processing in either documented atmosphere.
• Aqueous two-reflow cleanability: Residues are designed for hot deionized-water removal after one or two reflows.

Applications

SAC305 Type 4 or Type 5 SMT printing and air or nitrogen reflow with batch or inline aqueous cleaning.