SnCX Plus 07
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys
Main features
- Silver-Free Lead-Free Wave-Soldering Alloy
- Reduced Copper Dissolution at High Temperature
- Vaculoy Low-Dross Fast-Wetting Processing
Product Description
ALPHA® SnCX Plus® 07 is a silver-free, lead-free solder alloy for wave soldering, selective soldering, lead tinning, and rework processes. It is designed as an alternative to SnPb, SAC305, and other low-silver SAC alloys and is suitable for through-hole and surface-mount components on single-sided and mixed-technology assemblies. The alloy is engineered to limit copper dissolution, reduce dross generation, and provide fast wetting with smooth, bright solder fillets. Its approximate melting temperature is 227 °C, with a recommended solder-pot operating range of 255 to 270 °C.
Key features
- Silver-free, lead-free alloy: Designed as an alternative to SnPb, SAC305, and other low-silver SAC solder alloys.
- Controlled copper erosion: Engineered to minimize copper dissolution during extended high-temperature soldering and rework processes.
- Low-dross processing: Uses the proprietary Vaculoy® manufacturing process with a dross-reducing addition to limit included oxides and dross generation.
Applications / Suitable for
- Wave soldering
- Selective soldering
- Lead tinning
- Rework of through-hole and surface-mount components
TDS, SDS & Technical Documents
Technical Specifications
Chemical Properties
General Properties
Mechanical Properties
Additional Information
As-supplied / before-processing properties
Typical bulk-alloy and processing properties of ALPHA® SnCX Plus® 07. Typical technical data are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Alloy type | Silver-free, lead-free solder alloy | — | Maximum lead content: 0.05% |
| Melting temperature | Approximately 227 | °C | Typical |
| Density | 7.30 | g/cc | Typical |
| Hardness | 9.4 | HV | Test method not stated |
| Specific heat capacity | 0.198 | J/g/°C | At 100 °C |
| Thermal expansion coefficient | 23.8 | µm/m·°C | 30 to 100 °C |
| 24.3 | µm/m·°C | 100 to 180 °C | |
| Tensile stress | 42.0 | MPa | Bulk-alloy value; test method not stated |
| Yield stress | 33.4 | MPa | Bulk-alloy value; test method not stated |
| Elongation | 33.1 | % | Bulk-alloy value; test method not stated |
| Recommended solder-pot temperature | 255 to 270 (491 to 518) | °C (°F) | Wave and selective soldering guidance |
