ALPHA SLS65
Harmonization Code : 3404.90.00.00 | Artificial waxes and prepared waxes : Other
Main features
- Thermally Stable Bridge Control
- Low Solder-Ball Tendency
- Foam, Wave, or Spray Application
Product Description
ALPHA SLS 65 Liquid Soldering Flux provides an active, low-solids no-clean liquid formulation for wave soldering by foam, wave, or spray application. Its thermally stable activator system is designed to reduce solder bridging, while surface-tension control lowers solder-ball formation across a range of solder masks. The formulation leaves very low, non-tacky residue to limit interference with pin testing and maintain clean board appearance. The ready-to-use liquid contains 2.3% solids and is classified ORL0 under IPC J-STD-004. At 25 deg C, typical specific gravity is 0.801 +/- 0.003; acid number is 18 +/- 1 mg KOH/g. Application settings should be optimized for the board, components, and equipment.
Key features
- Thermally stable activation: Designed to reduce solder bridging in low-solids no-clean processing.
- Solder-ball control: Reduced surface tension limits solder-ball formation across varied solder masks.
- Low non-tacky residue: Very low residue supports pin testing and clean board appearance.
Applications
Wave soldering using foam, wave, or spray flux application.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Clear, colorless liquid | Typical | |
| Solids content | 2.3 | % by weight | Typical |
| Specific gravity | 0.801 +/- 0.003 | 25 deg C +/- 1.8 deg C | |
| Acid number | 18 +/- 1 | mg KOH/g | Typical |
| pH | 3.36 +/- 0.30 | 5% aqueous solution | |
| Flash point | 12 | deg C | T.C.C. |
| Shelf life | 360 | days | From date of manufacture |
| Flux classification | ORL0 | IPC J-STD-004 |
