ALPHA LONCO RF-800 FLUX
Harmonization Code : 3810.90.90 | Fluxes and other auxiliary preparations for soldering, brazing, welding
Main features
- Highly Active Low-Solids No-Clean Flux
- Low Non-Tacky Residue
- IPC J-STD-004 ROL0 Classification
Product Description
ALPHA® ROSIN FLUX 800 (RF-800) is a highly active, low-solids, no-clean liquid flux formulated for wave soldering in tin-lead and lead-free electronics assembly processes. Its proprietary activator system supports soldering across a broad operating window, including assemblies with less-solderable component leads and pads. RF-800 is particularly suited to bare copper boards protected with organic or rosin/resin coatings and tin-lead-coated PCBs. After soldering, it leaves a low level of non-tacky residue that can remain on the assembly and is readily penetrable during pin testing.
Key features
- Highly active no-clean formulation: Supports effective soldering with less than 5% solids while eliminating the normal requirement for post-solder cleaning.
- Broad process compatibility: Suitable for tin-lead and lead-free wave soldering with foam, wave, or spray flux application methods.
- Low, non-tacky residue: Leaves residue designed to remain on the board with reduced interference during pin testing.
Applications / Suitable for
- Tin-lead and lead-free wave soldering
- Bare copper PCBs protected with organic or rosin/resin coatings
- Tin-lead-coated printed circuit boards
- Foam, wave, and spray fluxing processes
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical properties of ALPHA RF-800 in its as-supplied liquid state.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Pale yellow liquid | — | Typical |
| Solids content | 4.1 | % wt/wt | Typical |
| Acid number | 18.0 ± 1.0 | mg KOH/g | Typical |
| Specific gravity | 0.794 ± 0.003 | — | At 25°C (77°F); typical |
| pH | 3.4 | — | 5% aqueous solution; typical |
| Flash point | 13 (56) | °C (°F) | T.C.C.; typical |
| Shelf life | 540 | days | From date of manufacture |
After-processing / final-state properties
Corrosion and electrical reliability results obtained with SAC305 alloy and uncleaned test boards under the stated test conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Silver chromate paper test | Pass | — | No halide detected; SAC305 alloy |
| Copper mirror test | Pass | — | No complete removal of copper; SAC305 alloy |
| IPC copper corrosion test | No corrosion | — | Type L result; SAC305 alloy |
| Surface insulation resistance, comb-down | 1.1 × 1010 | Ω | IPC J-STD-004A; uncleaned; 85°C/85% RH for 7 days; −50 V bias; measured at 100 V on IPC B-24 board |
| Surface insulation resistance, comb-up | 9.8 × 109 | Ω | IPC J-STD-004A; uncleaned; 85°C/85% RH for 7 days; −50 V bias; measured at 100 V on IPC B-24 board |
| Bellcore electrochemical migration resistance | Pass | — | TR-NWT-000078, Issue 3; uncleaned; 85°C/85% RH for 500 hours; 10 V bias; measured at 100 V on IPC B-25 B-pattern boards |
