ALPHA NR200
Harmonization Code : 3404.90.00.00 | Artificial waxes and prepared waxes : Other
Main features
- Low-Residue Pin-Test Surface
- Foam, Spray, or Wave Fluxing
- High-SIR Tack-Free Surface
Product Description
ALPHA NR200 Liquid Soldering Flux uses a ready-to-use, halide-free, rosin- and resin-free, low-solids formulation for wave soldering through-hole, mixed-technology, and surface-mount assemblies. It can be applied by foam, spray, or wave methods and combines high activity with virtually no visible residue on most solder masks. The resulting surface is tack-free and supports accurate pin testing without a separate cleaning step. Enhanced foaming and low odor add process flexibility. Typical as-supplied data include 2.0% solids, 0.805 +/- 0.003 specific gravity at 25 deg C, an ORM0 designation, and a 14 deg C T.C.C. flash point.
Key Features
- Low visible residue: Virtually no visible residue on most solder masks after wave soldering.
- Multiple application methods: Ready for foam, spray, or wave flux application.
- Pin-testable surface: Tack-free surface supports accurate pin testing without a separate cleaning step.
Applications
Wave soldering of through-hole, mixed-technology, and surface-mount assemblies using foam, spray, or wave application.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
Typical Properties
As Supplied
Typical values for the ready-to-use liquid flux.
| Property | Typical Value | Units | Method or Condition |
|---|---|---|---|
| Appearance | Clear, colorless liquid | Visual | |
| Solids content | 2.0 | % by weight | Typical |
| Specific gravity | 0.805 +/- 0.003 | 25 deg C | |
| Acid number | 18 +/- 1 | mg KOH/g | Typical |
| Flash point | 14 | deg C | T.C.C. |
| Shelf life | 540 | days | Typical |
| Flux classification | ORM0 | J-STD-004 |
