ALPHA CVP 520
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Low-Temperature Reflow for Sensitive Assemblies
- Extended Eight-Hour Stencil Life
- Configurable Alloy and Powder Selection
Product Description
ALPHA CVP-520 Solder Paste is a configurable low-temperature, lead-free, no-clean solder paste family for surface-mount assembly. Available Sn/Bi/Ag and Sn/Bi alloy options have melting points below 140 deg C and have been used with peak reflow profiles of 155 to 190 deg C. Type 3, Type 4, and Type 5 powder sizes are available by configuration, and the paste supports standard and fine-pitch stencil printing. Stencil life exceeds eight hours at 23 deg C and 50% RH. After reflow, the flux residue is clear and colorless and is designed to remain on the board. Exact alloy, powder size, and package are selected by SKU.
Key features
- Low-temperature reflow: Alloy options melt below 140 deg C and support peak reflow profiles of 155 to 190 deg C for temperature-sensitive assembly work.
- Extended stencil life: A stencil life greater than eight hours at 23 deg C and 50% RH supports sustained printing operations.
- Configurable printing formats: Type 3, Type 4, and Type 5 powders and multiple alloy options let the selected SKU match standard or fine-pitch printing needs.
Applications
Used for low-temperature SMT assembly, repeated-reflow processes with temperature-sensitive components or connectors, and supported BGA or through-hole integration using the selected configuration.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
Values and options apply to the CVP-520 family; exact alloy, powder type, and package are selected by SKU.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Available alloys | 42% Sn / 57.6% Bi / 0.4% Ag; 42% Sn / 57% Bi / 1.0% Ag; 42% Sn / 58% Bi | 1.0% Ag alloy available on request | |
| Powder size | Type 3, Type 4, Type 5 | Available family configurations | |
| Residue content | ~5 | % by weight | Approximate |
| Stencil life | >8 | hours | At 23 deg C and 50% RH |
| Refrigerated storage | 0 to 10 | deg C | For guaranteed stability |
| Refrigerated shelf life | 6 | months | Refrigerated paste |
| Room-temperature storage | 2 | weeks | Up to 25 deg C before use |
After-processing / final-state properties
Results apply to the selected CVP-520 configuration and the stated test conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Flux residue appearance | Clear, colorless | After reflow | |
| Surface insulation resistance | Pass; >= 1 x 10^8 | ohm | IPC J-STD-004C / TM-650 2.6.3.7; 7 days at 85 deg C / 85% RH, 12 V |
| Electromigration | Pass; final > 1 x 10^10 | ohm | JIS Z 3197:1999; 1000 hours at 85 deg C / 85% RH, 48 V DC; no migration |
| Voiding classification | Class 3 | IPC-7095; obtained with the stated reflow profile |
