LOCTITE ABLESTIK E 8502-1

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

LOCTITE ABLESTIK E 8502-1

Main features

  • One component
  • Low stress
  • Thermally conductive

Product Description

LOCTITE ABLESTIK E 8502-1 is a solventless modified epoxy non-conductive adhesive known for its versatility in bonding applications. LOCTITE ABLESTIK E 8502-1 boasts a formulation that combines low-stress properties with strong adhesion capabilities across a wide array of surfaces.

LOCTITE ABLESTIK E 8502-1 flexibility makes it well-suited for scenarios involving disparate coefficients of thermal expansion (CTE), ensuring effective bonding even in mismatched CTE situations. 

Product Family

ABLESTIK E8502-1

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Specific Gravity Specific Gravity
1.15 - 1.2
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
60 - 70 °C
Thermal Conductivity Thermal Conductivity
0,6 W/m.K
Electrical Properties
Surface Resistivity Surface Resistivity
170000000000000 Ohms/sq
Volume Resistivity Volume Resistivity
40700000000000 Ohms⋅cm
Physical Properties
Viscosity Viscosity
40000 - 50000 mPa.s

Additional Information

Curing schedule

Temperature Cure time
120°C 90
150°C 60
175°C 15

 

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