LOCTITE ABLESTIK ABP 8037TI
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- High-reliability LED manufacture
- High thermal conductivity
- Small die on Au-finish LF
Product Description
LOCTITE ABLESTIK ABP 8037TI silver-filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates.
LOCTITE ABLESTIK ABP 8037TI silver-filled die attach adhesive paste is specifically designed to attach small diodes in high volume manufacturing. Even more specifically, it is the highest volume silver-filled die attach paste for high reliability LED attach and manufacture when using small die on Au-finished leadframes. Used in high-volume manufacturing throughout China and Malaysia.
LOCTITE ABLESTIK ABP 8037TI is similar to Loctite Ablestik ABP 8037T, with a minor raw material change that made it adjust its naming convention.
Cure Schedule
- 30 minute ramp to 175ºC, hold 30 minutes @ 175 °C
- 30 minute ramp to 150ºC, hold 30 minutes @ 150 °C
ABLESTIK ABP8037TI
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Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
Specific Characteristics:
- High Thermal Conductivity
- High volume diode (LED) manufacturing
- Completely supersedes ABP 8037T which has been discontinued
- Very good on small die
- Very good on gold (Au) finishing leadframes
