LOCTITE ABLESTIK ABP 2053SNP
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Formulated without intentionally added PFAS
- One-component
- Low stress
Product Description
LOCTITE® ABLESTIK ABP 2053SNP is a non-conductive die attach adhesive that is ideal for array packaging. This version of LOCTITE® ABLESTIK ABP 2053S is specially formulated without intentionally added PFAS, making it a sustainable choice for your assembly needs.
Recommended Cure Schedule
- 30 minute ramp to 175 ºC + 15 minutes @ 175ºC
- 30 minute ramp to 150 ºC + 60 minutes @ 150ºC
Product Key Features
- Non-conductive formulation for reliable electrical insulation.
- One-component system for easy and efficient application.
- Low stress to protect delicate components from damage.
- Formulated without intentionally added PFAS, aligning with environmental and safety standards.
Applications
-
Die attach in array packaging & general semiconductor assembly requiring non-conductive adhesives.
ABLESTIK ABP2053SNP
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Technical Specifications
General Properties
Work life @25°C
Work life @25°C
24 hours
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
-20 °C
Weight Loss @ 300°C
Weight Loss @ 300°C
1.7 %
Chemical Properties
Moisture absorption
Moisture absorption
0.7 %
Physical Properties
Thixotropic index
Thixotropic index
3
Viscosity
Viscosity
16,000 mPa.s
