LOCTITE ABLESTIK 789-3
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Non conductive
- Good moisture resistance
- Substrate attach
Product Description
LOCTITE ABLESTIK 789-3 die attach adhesive is designed for microelectronic applications. This adhesive exhibits strong adhesion to difficult-to-bond metals and retains its bond strength after exposure to moisture.
LOCTITE ABLESTIK 789-3 is a non conductive epoxy adhesive with good moisture resistance and high bond strength. It is typically used for substrate attach and package sealing on gold, silver and copper substrates.
Cure Schedule
- 30 minutes @ 150°C
- 4 hours @ 93°C
ABLESTIK 789-3
1. Select Package Type
Loading pricing…
Product availability 
Shipping in 20 days
Shipping in 12 weeks
Shipping in 40 days
Shipping in 20 days Shipping in 12 weeks Shipping in 40 daysPackaging
Please select Package Type.
Technical Specifications
General Properties
Work life @25°C
Work life @25°C
2184 hours
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
126 °C
Thermal Conductivity
Thermal Conductivity
0.3 W/m.K
Weight Loss @ 300°C
Weight Loss @ 300°C
0.28 %
Electrical Properties
Volume Resistivity
Volume Resistivity
2000000000000000 Ohms⋅cm
Physical Properties
Viscosity
Viscosity
36,500 mPa.s
