LOCTITE ABLESTIK 3230

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Loctite Ablestik 3230 Loctite Ablestik 3230

Main features

  • Improved JEDEC performance
  • Fast cure
  • Excellent adhesion to copper

Product Description

LOCTITE ABLESTIK 3230 electrically conductive, silver filled, die attach epoxy adhesive is designed for high reliability package applications . It can be used in a variety of package sizes.

LOCTITE ABLESTIK 3230 offers low stress and excellent adhesion to copper, combined with excellent JEDEC performance.

Cure Schedule

  • 30 minute ramp to 175°C + 15 minutes @ 175°C

Technical Specifications

General Properties
Work life @25°C Work life @25°C
24 hours
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
37 °C
Thermal Conductivity Thermal Conductivity
0.6 W/m.K
Chemical Properties
Moisture absorption Moisture absorption
0.29 %
Physical Properties
Thixotropic index Thixotropic index
5.6
Viscosity Viscosity
9,500 mPa.s

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