ABLESTIK 24
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- Water-Clear Thin-Bondline Adhesive
- 30-Minute Pot Life
- Flexible Cured Adhesive
Product Description
LOCTITE® ABLESTIK 24 is a water-clear, two-part epoxy adhesive for non-electrically conductive assembly bonding. It is recommended for joining transparent materials such as glass and for applications where a thin bond line is desired. The mixed adhesive has a viscosity of 800 mPa·s at 25 °C and a 30-minute pot life in 50 g quantities. It cures at room temperature, with full properties developed in 16 to 24 hours, and forms flexible, resilient bonds between materials with mismatched coefficients of thermal expansion.
Key features
- Water-clear epoxy system: Supports transparent-material bonding where adhesive appearance and thin bond lines are important.
- Room-temperature cure: Two-part system cures at 25 °C, with full properties developed in 16 to 24 hours.
- Flexible cured adhesive: Forms resilient bonds between materials with mismatched coefficients of thermal expansion.
Applications / Suitable for
- Joining transparent materials such as glass
- Thin bond-line adhesive assembly
- Non-electrically conductive bonding of metals, ceramics, polycarbonate, polystyrene, polysulfone, and rigid plastics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical values for the mixed two-part adhesive before final cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Two-component adhesive system |
| Appearance | Water clear | — | As supplied / mixed adhesive appearance |
| Mix ratio | 100:28 | — | Part A:Part B by weight |
| Mixed viscosity | 800 | mPa·s | Mixed material at 25°C |
| Pot life | 30 | minutes | At 25°C, 50 g quantities |
| Cure schedule | 1 to 3 | hours | At 25°C; full properties develop in 16 to 24 hours |
| Optimal storage | 18 to 25 | °C | Store in original, tightly covered containers in clean, dry areas |
After-processing / final-state properties
Typical values for the cured adhesive after room-temperature cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Tensile lap shear strength | 12 | N/mm² | Typical performance of cured material |
| Thermal conductivity | 0.2 | W/(m·K) | Typical cured-material physical property |
| Coefficient of linear thermal expansion | 60 | ppm/°C | Typical cured-material physical property |
| Volume resistivity | 1 × 10¹⁴ | ohm-cm | At 25°C |
| Dielectric strength | 16.5 | kV/mm | ASTM D149 |
| Operating temperature | 90 continuous; 120 intermittent | °C | Cured adhesive service exposure |
