ABLESTIK 2156
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- 0.84 W/(m K) Thermal Conductivity
- Heat-Sensitive Component Staking
- -70 to 100 deg C Operating Range
Product Description
LOCTITE® ABLESTIK 2156 BIPAX is a two-component, thermally conductive and electrically insulating epoxy adhesive for staking and assembly applications. The tan, thixotropic system mixes at 100:23 resin-to-hardener by weight and is designed to develop strong, impact-resistant bonds through room-temperature or accelerated heat cure. It is documented for staking heat sinks, transistors, diodes, resistors, integrated circuits, and other heat-sensitive components to printed circuit boards and for bonding metals, silica, alumina, sapphire, ceramics, glass, and plastics. The mixed adhesive has a typical viscosity of 12,000 mPa·s at 25°C and a five-minute pot life.
Key features
- Thermally conductive and electrically insulating: Typical cured thermal conductivity is 0.84 W/(m·K).
- Thixotropic, high-impact adhesive: Supports controlled placement and strong bonding in electronic-component staking applications.
- Room-temperature or accelerated cure: Guideline schedules include 24 hours at 25°C or 1 hour at 25°C followed by 2 hours at 65°C.
Applications / Suitable for
- Staking heat sinks and heat-sensitive components to printed circuit boards
- Staking transistors, diodes, resistors, and integrated circuits
- Bonding metals, glass, plastics, and ceramics
- Bonding silica, alumina, and sapphire
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical component, mixed, storage, and guideline cure information before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Two-component adhesive requiring mixing |
| Appearance — mixed | Tan | — | Uniformly mixed BIPAX system |
| Appearance — resin | Translucent paste | — | LOCTITE ABLESTIK 2156-R SDS |
| Appearance — hardener | Amber liquid | — | LOCTITE ABLESTIK 2156-H SDS |
| Mix ratio — resin:hardener | 100:23 | by weight | Documented BIPAX mix ratio |
| Mixed viscosity | 12,000 | mPa·s (cP) | Immediately after mixing at 25°C; test method not stated |
| Specific gravity — mixed | 2.3 | — | Typical TDS value |
| Specific gravity — resin | 3.2 | — | LOCTITE ABLESTIK 2156-R SDS |
| Specific gravity — hardener | 1.2 | — | LOCTITE ABLESTIK 2156-H SDS |
| Pot life | 5 | minutes | Temperature, test mass, and endpoint not stated |
| Recommended cure schedule | 24 | hours | At 25°C; guideline recommendation |
| Alternative cure schedule | 1 hour plus 2 hours | — | 1 hour at 25°C followed by 2 hours at 65°C; guideline recommendation |
| Optimal storage | ≤27 | °C | TDS value; component SDSs specify storage at or below 25°C |
After-processing / final-state properties
Typical cured physical, thermal, and bonded-joint properties. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating-temperature range | -70 to 100 | °C | Documented product range |
| Hardness | 80 | Shore D | Cure condition and test method not stated |
| Glass-transition temperature | 33.0 | °C | Test method and cure condition not stated |
| Coefficient of linear thermal expansion | 26 | ppm/°C | Temperature range, test method, and cure condition not stated |
| Thermal conductivity | 0.84 | W/(m·K) | Test method, test temperature, specimen geometry, and cure condition not stated |
| Reactive solids content | 100 | % | Typical TDS value |
| Lap shear strength — aluminum to aluminum | 23.4 (3,400) | N/mm² (psi) | After curing for 2 hours at 65°C; test temperature, surface preparation, bondline, and test method not stated |
