LOCTITE ABLESTIK 2113
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Low-Viscosity Optical Bonding
- Fine-Detail Flow and Wetting
- Electrically Insulating Cured Adhesive
Product Description
LOCTITE ABLESTIK 2113 BIPAX is a two-component, transparent, non-conductive epoxy adhesive supplied at a 100:11 resin-to-hardener mix ratio in a BIPAX mixing-dispenser package. Formulated for applications requiring low initial viscosity and near-transparent color, it offers excellent flow and wetting properties for fine detail work and difficult-to-reach bond lines. This solvent-free system cures at room temperature over 24 hours or faster at 65°C, and supports continuous service from -60°C to 130°C. It is recommended for fiber optic assembly, structural laminating, and high-performance aerospace and electronic applications, bonding glass, ceramics, metals, and plastics with good chemical resistance and electrical insulation.
Key features
- Low viscosity, transparent: 300 mPa·s mixed viscosity with near-transparent cured appearance for optical clarity needs.
- Excellent flow and wetting: Supports fine detail bonding and fiber optic assembly applications.
- Electrically insulating: Dielectric strength of 410 volts/mil for demanding electronic applications.
Applications / Suitable for: Fiber optic assembly, structural laminating, and high-performance aerospace and electronic applications.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical properties of the uncured, mixed material prior to cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio (Resin : Hardener) | 100 : 11 | by weight | — |
| Viscosity, mixed | 300 | mPa·s (cP) | @ 25°C, mixed |
| Specific gravity, mixed | 1.16 | — | Mixed material |
| Pot life | 30 | minutes | Mixed material |
After-processing / final-state properties
Typical properties of the fully cured material after the recommended cure schedule.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 88 | Shore D | Cured material |
| Glass transition temperature (Tg) | 77.0 | °C | Cured material |
| Dielectric strength | 410 | volts/mil | Cured material |
| Volume resistivity | 6.00×10¹³ | ohm·cm | @ 25°C |
| Lap shear strength, Al to Al | 15 (2,200) | N/mm² (psi) | Sample cured 2 hr @ 65°C |
