3M 282

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

3M 282

Main features

  • Thixotropic Low-Sag Application
  • Multi-Method Resin Placement
  • Semiflexible Class F Performance

Product Description

3M Scotchcast Electrical Resin 282 is a two-part, oven-curing, thixotropic epoxy liquid resin for coating, filling, patching, insulating, and encapsulating electrical components. The stated component ratio is 2:3 by weight and 37:63 by volume. Once combined, the material retains thixotropic flow for dipping, spraying, extruding, or troweling with minimal run-off or sag during cure. Typical pot life is 3 to 4 days at 23 deg C, with 23-minute gel time at 121 deg C. The cured semiflexible Class F resin provides 65 Shore D hardness, 45% elongation, and thermal-shock resistance for coils, transformers, motors, modules, and strain-sensitive circuitry.

Key features

  • Thixotropic low-sag handling: The mixed resin limits run-off and sag during supported coating and cure operations.
  • Multiple application methods: The material can be applied by dipping, spraying, extruding, or troweling.
  • Semiflexible Class F cure: Typical cured properties include 65 Shore D hardness, 45% elongation, and a 155 deg C temperature rating.

Applications

Applications include dipping, coating, filling, patching, insulating, and encapsulating coils, transformers, motors, modules, strain-sensitive circuitry, and other electrical or electronic components.

Technical Specifications

General Properties
Color Color
Buff
Component System Component System
Two Part (A / B)
Pot Life Pot Life
3-4 days
Specific Gravity Specific Gravity
1.43
Mechanical Properties
Elongation Elongation
45 %
Other Properties
Storage Temperature Storage Temperature
20 - 30 °C

Additional Information

Technical properties

As-supplied / before-processing properties

Handling values are typical; component values and mix-ratio bases remain separated.

PropertyValueUnitMethod / condition
Mix ratio by weight (A:B)2:3-Before processing
Mix ratio by volume (A:B)37:63%Before processing
RheologyThixotropic-Parts A and B and mixed resin at 23 deg C
Density (A / B)1.50 / 1.32kg/LTypical
Flash point (A / B)202 / 188deg CTypical
Gel time23minTypical at 121 deg C
Cure guide15 to 20 h / 6 to 8 h / 2 to 3 h-75 deg C / 95 deg C / 120 deg C
Pot life3 to 4daysTypical at 23 deg C
ColorBuff-Typical
Technical properties

Final-state / after-processing properties

Cured values are typical and are not specification limits.

PropertyValueUnitMethod / condition
Hardness65Shore DTypical
Specific gravity1.43-Typical; cured
Compressive strength3,500psiTypical; 10% compression
Tensile strength2,100psiTypical
Elongation at break45%Typical
Electric strength375 (14.8)V/mil (kV/mm)Typical; 1/8 in (3.175 mm) sample
Thermal-shock resultPass-10 cycles from -65 to 130 deg C; 1/4 in (3.175 mm) Olyphant insert
Moisture absorption0.32% weight increaseTypical; 240 h at 96% RH
Volume resistivity>1 x 10^15ohm-cmTypical at 23 deg C

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